采用飞秒激光直写技术在预涂覆廉价铜离子涂层的柔性基体上通过激光还原得到纳米铜颗粒并原位连接形成导电结构,成功制得了具有优良导电性能的铜微电极。研究了不同激光功率及扫描速率对微电极形貌结构、导电性能的影响。结果表明:在不损伤基体的条件下,随着辐照激光能量密度增大,铜微电极的导电性能明显提高;当激光功率为1210 mW、扫描速度为1 mm/s时,所制备的微电极的成分主要为铜,导电性能较好,方阻达到2.74 Ω·sq -1。该研究为发展低成本、高效率的柔性电极制造提供了一种新技术,并拓宽了纳米铜材料在电子行业的应用范围。

Femtosecond laser direct writing technique is used to fabricate microelectrodes on flexible substrates with a cheap copper ion pre-coating. The copper nanoparticles are obtained using laser-induced reduction and in situ bonding, and the as-written copper electrodes exhibit excellent electrical conductivity. Further, the effects of laser power and scan speed on the microstructure and electrical conductivity of the electrodes are studied. The results denote that the conductivity generally increases with the increase of laser energy density. The obtained copper electrodes are mostly network-like metallic copper and exhibit the lowest sheet resistance of 2.74 Ω·sq ^-1 at a laser power of 1210 mW and a scan speed of 1 mm/s. This research provides a new technique for developing low-cost and high-efficiency flexible devices, which can benefit the application of copper nanomaterials in the electronics industry.