晶体材料微加工技术是制备微电子器件、微机电系统器件的关键技术。飞秒激光辐照结合湿法腐蚀加工技术不仅可以去除飞秒激光诱导微结构表面缺陷,提高微结构表面光滑度,还在制备高纵横比结构、内部通道等方面具有独特的优势,为晶体加工开辟了新的道路。本文概述了飞秒激光辐照结合湿法腐蚀加工技术特点、原理和优势,总结了其在硅、碳化硅、蓝宝石晶体材料微结构制备中的研究进展,讨论了该技术的不足及其未来发展。

Micromachining of crystal materials is a vital technology for fabricating microelectronic device and microelectromechanical system. The technology combined femtosecond laser irradiation and wet etching exhibits advantages in removing femtosecond laser-induced defects and smoothing microstructure surfaces. It also exhibits unique perks in preparing high aspect ratio structures and burying microchannels in materials, thereby facilitating a new approach for micromachining of crystal materials. This study summarizes the technical features, principles, and advantages of femtosecond laser irradiation and wet etching micro-nano processing technique and demonstrates the research progress in fabricating microstructures in crystal materials such as silicon, silicon carbide, and sapphire. The limitations and future advancements of this technology are also discussed.