光学学报, 2018, 38 (1): 0105001, 网络出版: 2018-01-22   

基于改进型结构分解的极紫外光刻掩模衍射谱快速仿真方法

A Rapid Simulation Method for Diffraction Spectra of EUV Lithography Mask Based on Improved Structural Decomposition
张恒 1,2,*李思坤 1,2王向朝 1,2
作者单位
1 中国科学院上海光学精密机械研究所信息光学与光电技术实验室, 上海 201800
2 中国科学院大学, 北京 100049
摘要
对极紫外光刻掩模的吸收层和多层膜分别建模, 将二者组合以实现对具有复杂图形分布的掩模衍射谱的快速精确仿真。对存在图形偏移的吸收层, 采用扩展的边界脉冲修正法进行仿真。对无缺陷及含缺陷的多层膜, 分别采用等效膜层法和基于单平面近似的方法进行仿真。采用等效膜层法修正单平面近似法中的平面镜反射系数, 提高了大角度(大于10°)入射下的含缺陷多层膜的仿真精度。采用张量积、矢量化并发计算提高了仿真速度。对无缺陷掩模的图形关键尺寸仿真表明, 改进方法与严格仿真的误差在0.4 nm以内, 仿真精度与速度均优于所对比的域分解方法。对含缺陷掩模, 改进方法可准确仿真图形关键尺寸随吸收层偏移的变化, 与严格仿真相比, 对周期为240 nm的掩模, 在0.6 nm仿真误差下, 仿真速度提升了150倍。
Abstract
Fast and accurate diffraction simulation for extreme-ultraviolet lithography mask with complex patterns is achieved via combination of the expanded absorber model and optimized multilayer film model. The modified thin-mask absorber model is expanded to enable simulation of absorber shifting. Equivalent-layer model and single-surface approximation model are adapted for defective and defect-free multilayer film simulation respectively. For incident angle larger than 10°, the simulation accuracy of the defective multilayer film is improved when the ideal reflection of single surface is modified with the equivalent-layer model. Simulation speed is enhanced by concurrent computing tensor product and vectorization concurrency. For defect-free mask with different simulation parameters, the modified method achieves better simulation accuracy and speed (critical dimension errors within 0.4 nm compared with the rigorous method) than the domain decomposition method. For defective mask, the critical dimension change versus absorber shifting is accurately simulated by the modified method, and the simulation errors are within 0.6 nm (compared with rigorous method) for a mask of 240 nm pitch while the modified method is 150 times faster than the rigorous method.

张恒, 李思坤, 王向朝. 基于改进型结构分解的极紫外光刻掩模衍射谱快速仿真方法[J]. 光学学报, 2018, 38(1): 0105001. Zhang Heng, Li Sikun, Wang Xiangzhao. A Rapid Simulation Method for Diffraction Spectra of EUV Lithography Mask Based on Improved Structural Decomposition[J]. Acta Optica Sinica, 2018, 38(1): 0105001.

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