针对原curamik微通道热沉因进水通道流量不均而导致散热不均匀的现象，基于FLUENT软件对其进行数值模拟。从内部结构及热沉材料方面提出优化方案，并进一步获得在热沉高度和进出口宽度为固定值的条件下，微通道宽度、间距及通道脊长度3个因素分别对芯片表面温升和压降的影响规律。根据优化的参数，通过选区激光熔化技术制备获得纯镍微通道热沉并进行芯片封装测试。结果显示，微通道热沉散热均匀，热阻为0.39 K/W，压降为140 kPa，能够满足输出功率为80 W的半导体激光器单巴条芯片的散热要求。

Aiming at the uneven heat dissipation induced by the uneven water channel flow of microchannel-heat sink for original curamik, the numerical simulation based on FLUENT software is carried out. Optimization scheme is proposed from the aspect of internal structure and the heat sink material. The influence of the microchannel width, interval and microchannel ridge length on the chip surface temperature rise and pressure drop are obtained, when the heat sink height and the width of the import and export are invariant. Based on the optimized parameters, the pure Ni microchannel heat sink is manufactured by selective laser melting technology, and the chip is packaged and tested. The results show that thermal resistance of microchannel heat sink reaches 0.39 K/W, the pressure drop reaches 140 kPa, which can meet the need of 80 W semiconductor laser cooling requirements.