采用热弹性模型, 对光学薄片点胶过程进行了有限元分析。对点胶后影响工件面形变化(Δp)的工艺参数进行了优化。研究结果表明, 对于光学薄片(直径为100 mm, 厚度为2 mm), 宜选择具有高弹性模量和低热膨胀系数的薄底板材料, 且胶点的半径、个数及弹性模量越小, Δp越小; 胶点位置应该避开高Δp区域; 胶点的热膨胀系数对Δp的影响较小。

By using the thermoelastic model, the finite element analysis of dispensing process of optical slices is performed. The process parameters which influence the surface deformation of workpieces (Δp) after dispensing are optimized. For an optical slice with a diameter of 100 mm and a thickness of 2 mm, a thin base plate with high elastic modulus and low thermal expansion coefficient is the optimal selection. Δp decreases with the decreases of radius, number and elastic modulus of glue dots. The glue dot position should avoid the high Δp zones. The thermal expansion coefficient of glue dots has little influence on Δp.