Application of Continuous Polishing Technology to Manufacturing of a Lens Array
Jiao Xiang, Zhu Jianqiang, Fan Quantang, Li Yangshuai. Application of Continuous Polishing Technology to Manufacturing of a Lens Array[J]. Collection Of theses on high power laser and plasma physics, 2015, 13(1): 0708011.
[1] 欧阳小平, 竺庆春, 朱宝强, 等. 列阵透镜对能量测量影响的分析[J]. 中国激光, 2005, 32(8): 1110-1112.
[2] 邓锡铭, 梁向春, 陈泽尊, 等. 用列阵透镜实现大焦斑面的均匀照射[J]. 中国激光, 1985, 12(5): 257-260.
[3] 陈泽尊, 梁向春, 邓锡铭. 用透镜阵聚焦实现均匀辐照的计算机分析[J]. 中国激光, 1986, 13(2): 65-70.
[4] 丘悦, 钱列加, 黄宏一, 等. 用消衍射方法改善透镜列阵的辐照均匀性[J]. 中国激光, 1995, 22(1): 27-31.
[5] 傅思祖, 孙玉琴, 黄秀光, 等.“神光Ⅱ”装置靶面均匀辐照系统的优化设计[J]. 中国激光, 2003, 30(2): 129-133.
[6] 傅思祖, 黄秀光, 吴江, 等. 利用“神光-Ⅱ”激光装置多路光束叠加直接驱动下的冲击波平面性及稳定性[J]. 强激光与粒子束, 2003, 15(6): 570-574.
[7] Cooke F, Brown N, Prochnow E. Annular lapping of precision optical flatware[J]. Optical Engineering, 1976, 15(5): 407-415.
[8] 龙驭球. 弹性地基梁的计算[M]. 北京: 人民教育出版社, 1981.
Long Yuqiu. Calculation for Beam on Elastic Foundation[M]. Beijing: People′s Education Press, 1981.
[9] Berggren R R, Schmell R A. Pad polishing for rapid production of large flats[C]. SPIE, 1997, 3134: 252-257.
[10] Tesar A A, Fuchs B A. Removal rates of fused silica with cerium oxide/pitch polishing[C]. SPIE, 1991, 1531: 80-90.
[11] Onemoon Chang, Hyoungjae Kim, Kihyun Park, et al.. Mathematical modeling of CMP conditioning process[J]. Microelectronic Engineering, 2007, 84(4): 577-583.
[12] Yi-yang Zhou, Eugene C Davis. Variation of polish pad shape during pad dressing[J]. Materials Science and Engineering, 1999, 68(2): 91-98.
Jiao Xiang, Zhu Jianqiang, Fan Quantang, Li Yangshuai. Application of Continuous Polishing Technology to Manufacturing of a Lens Array[J]. Collection Of theses on high power laser and plasma physics, 2015, 13(1): 0708011.