讨论将热压导光板的网点高度从2.0 μm提升到4.0 μm，以应对薄化高端背光。使用两种研究

How to raise the pattern height of the hot-pressed light guide plate from 2.0 μm to 4.0 μm was explored, in order to cope with the thinned high-end backlight. To achieve the purposes above, two parts need to be studied. Firstly, how to raise the height of the rolling-stamping patterns, which could be achieved through foundry casting or optimizing the laser power and frequency to raise the pattern height of the upper crater of the core of mold without collapse. The second was to effectively transfer the high dot roller to the guide through the adjustment of temperature, hot pressing speed and pressure Light board. In the conclusion, the optimal laser P value was verified to be 126 W, the hot-pressure parameter 155 ℃, the speed 4 000 cm·min^-1, the pressure 3 000 N, and finally, the pattern height of the hot-pressed light guide plate was improved from 2.0 μm to 4.0 μm.