[1] Lei S J, Ma Q, Yoon D K, et al. Heat dissipation of LED back light units based on TRZZ ［J］. Chin. J. Liq. Cryst. Disp.(液晶与显示), 2012, 27(1):56-60 (in Chinese).

[2] Li D S, Zou L, Zhang Y C, et al. Evaluation of reliability for LED lamp base on fuzzy algorithm ［J］. Opt. Precision Eng.(光学 精密工程), 2012, 20(12):2661-2666 (in Chinese).

[3] Luo X B, Yang J H, Gan Z Y, et al. Analysis and optimization on microjet cooling system for high power LED ［J］. J. Eng. Thermophys.(工程热物理学报), 2008, 29(11):1909-1914 (in Chinese).

[4] Mo D C, Chen Y, Lu S S. Experimental study on high efficient flatten loop heat pipe ［J］. J. Eng. Thermophys.(工程热物理学报), 2007, 28(1):229-232 (in Chinese).

[5] Tang Z W, Huang Q, Zhao Z L. An integrated high-power LED refrigerated by semiconductor ［J］. Semicond. Optoelectron.(半导体光电), 2007, 28(8):471-474 (in Chinese).

[6] Chai W W, Chen Q H, Li L H, et al. Heat dissipation analysis of high power LED connected to copper coated heat sink by soldering ［J］. Chin. J. Lumin.( 发光学报), 2011, 32(11):1171-1175 (in Chinese).

[7] Minseok H, Samuel G. Development of a thermal resistance model for chip-on-board packaging of high power LED arrays ［J］. Microelectron. Reliab., 2012, 52:836-844.

[8] Zhang J X, Niu P J, Li H Y, et al. Study on heat dissipation performance of LED array using thermal circuit method ［J］. Chin. J. Lumin.(发光学报), 2013, 34(4):516-522 (in Chinese).

[9] Li D C, Yang L, Wang P, et al. Research on the temperature stability of high-voltage power supply ［J］. J. Lanzhou Univ.(兰州大学学报), 2006, 42(3):76-79 (in Chinese).

[10] Gao Y B. Optimization of Plate Fin Natural Convective Heat Sink ［D］. Wuhan: Huazhong University of Science and Technology, 2008 (in Chinese).