在用化学镀结合电镀方法对光纤布拉格光栅(FBG)进行金属化保护的过程中产生的应力直接影响到金属化FBG(MFBG)的传感精度。为此，基于应力产生的机制，对应力作用下化学镀和电镀过程中FBG的谐振谱变化进行了分析。实验发现化学镀后FBG谐振谱出现了较大的谱带展宽与峰值损耗减少。对化学镀产生的应力进行了理论及数值分析，结果显示热应力在FBG内部产生了扰动。通过延长化学镀后冷却时间的方法减少热应力，并通过充分搅拌化学镀液的方法减少应力的不均匀性，优化后的化学镀应力对FBG的影响很小。其后的电镀实验显示电镀过程是产生应力的主要原因。通过稳定较高的电镀温度、充分搅拌及采用双电极的方法达到了尽可能减少电镀过程应力对FBG频谱影响的目的。对优化化学镀和电镀条件后制成的MFBG进行温度传感实验表明，其回程误差小于已有的报道。

Stress produced in metallization of fiber Bragg grating (FBG) using electroless-electroplating method affects the sensing accuracy of FBG directly. Based on the mechanism of stresses, the changes of FBG′s transmission spectrum in metallization are studied for better sensing accuracy. Experiments show that electroless plated FBG exhibits broadened spectrum and reduced peak value. Theory and simulation analyses are conducted to study the stress in electroless plating. Results show that the thermal stress causes perturbation in FBG. Prolonging the cooling time is used to reduce the thermal stress. And during the electroless plating, the solution is mixed timely to make the stress uniform. It is shown that stress in electroless plating with the optimal condition affects the FBG little. The following electroplating experiments show that most stress is produced in the electroplating process. The changes of FBG′s spectrum are minimized by stabilizing higher electroplating temperature, mixing timely and using double electrodes. Finally, temperature sensor experiments for the metal coated FBG (MFBG) metalized under the optimized condition prove that the hysterisis error is reduced compared with the reported results.