C-mount封装激光器热特性分析与热沉结构优化研究
张晓磊, 薄报学, 张哲铭, 顾华欣, 刘力宁, 徐雨萌, 乔忠良, 高欣. C-mount封装激光器热特性分析与热沉结构优化研究[J]. 发光学报, 2017, 38(7): 891.
ZHANG Xiao-lei, BO Bao-xue, ZHANG Zhe-ming, GU Hua-xin, LIU Li-ning, XU Yu-meng, QIAO Zhong-liang, GAO Xin. Thermal Characteristics Analysis of C-mount Sink Package Laser and Optimization of Heat Sink Structure[J]. Chinese Journal of Luminescence, 2017, 38(7): 891.
[1] OU F, LI X Y, LIU B Y, et al.. Enhanced radiation-loss-based radial-waveguide-coupled electrically pumped microresonator lasers with single-directional output [J]. Opt. Lett., 2010, 35(10): 1722-1724.
[2] 海一娜, 邹永刚, 田锟, 等. 水平腔面发射半导体激光器研究进展 [J]. 中国光学, 2017, 10(2): 194-206.
[3] 黄晶, 胡秀寒, 陈卫标. LD抽运1 kHz电光调Q 946 nm Nd∶YAG激光器 [J]. 中国激光, 2015, 42(6): 0602008-1-6.
[4] 田锟, 邹永刚, 马晓辉, 等. 面发射分布反馈半导体激光器 [J]. 中国光学, 2016, 9(1): 51-64.
[5] 潘碧玮, 余力强, 陆丹, 等. 20 kHz窄线宽光纤光栅外腔半导体激光器 [J]. 中国激光, 2015, 42(5): 0502007-1-5.
[6] 方金祥, 董世运, 徐滨士, 等. 考虑固态相变的激光熔覆成形应力场有限元分析 [J]. 中国激光, 2015, 42(5): 0502009-1-8.
[7] LIU X Y, MA H, YU D Q, et al.. Optimal design analysis for thermal performance of high power 2.5D package [J]. J. Semicond., 2016, 37(7): 035006-1-5.
[8] 倪羽茜, 井红旗, 孔金霞, 等. 高功率半导体激光器陶瓷封装散热性能研究 [J]. 发光学报, 2016, 37(5): 562-566.
NI Y X, JING H Q, KONG J X, et al.. Thermal performance of high-power semiconductor laser packaged by ceramic submount [J]. Chin. J. Lumin., 2016, 37(5): 562-566. (in Chinese)
[9] ERBERT G, BRWOLFF A, SEBASTIAN J, et al.. High-power broad-area diode lasers and laser bars [M]. DIEHL R. High-Power Diode Lasers. Berlin Heidelberg: Springer, 2000: 173-223.
[10] 马祥柱, 霍晋, 曲轶, 等. C-mount封装不同激光器芯片尺寸的热阻分析 [J]. 发光学报, 2011, 32(2): 184-187.
[11] JING H Q, ZHONG L, NI Y X, et al.. Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics [J]. J. Semicond., 2015, 36(10): 102006-1-6.
[12] LIU Y, LEUNG S Y Y, WONG C K Y, et al.. Thermal simulation of flexible LED package enhanced with copper pillars [J]. J. Semicond., 2015, 36(6): 064011-1-4.
[13] 王胜楠, 薄报学, 许留洋, 等. 基于腔面非注入区的半导体激光器的热特性分析 [J]. 发光学报, 2014, 35(8): 969-973.
[14] 吴启保, 青双桂, 熊陶, 等. 大功率LED器件封装材料的研究现状 [J]. 化工技术与开发, 2009, 38(2): 15-17.
WU Q B, QING S G, XIONG T, et al.. Current situation of high-power LED encapsulant [J]. Technol. Dev. Chem. Ind., 2009, 38(2): 15-17. (in Chinese)
[15] TIOTSOP M, FOTUE A J, KENFACK S C, et al.. Electro-magnetic weak coupling optical polaron and temperature effect in quantum dot [J]. J. Semicond., 2015, 36(10): 102001-1-7.
[16] 王淑娜, 张普, 熊玲玲, 等. 温度对高功率半导体激光器阵列“smile”的影响 [J]. 光子学报, 2016, 45(5): 0514001.
[17] MONT F W, KIM J K, SCHUBERT M F, et al.. High-refractive-index TiO2-nanoparticle-loaded encapsulants for light-emitting diodes [J]. J. Appl. Phys., 2008, 103(8): 083120-1-6.
[18] 李贺, 梁静秋, 梁中翥, 等. AlGaInP材料LED微阵列热学特性分析 [J]. 光学学报, 2016, 36(1): 0123001-1-8.
[19] TABEI E, YAMAMOTO A. Curable silicone resin composition: U.S. US7291691B2 [P]. 2007-11-06.
[20] 王文, 高欣, 周泽鹏, 等. 百瓦级多芯片半导体激光器稳态热分析 [J]. 红外与激光工程, 2014, 43(5): 1438-1443.
WANG W, GAO X, ZHOU Z P, et al.. Steady-state thermal analysis of hundred-watt semiconductor laser with multichip-packaging [J]. Infrared Laser Eng., 2014, 43(5): 1438-1443. (in Chinese)
[21] 井红旗, 仲莉, 倪羽茜, 等. 高功率密度激光二极管叠层散热结构的热分析 [J]. 发光学报, 2016, 37(1): 81-87.
张晓磊, 薄报学, 张哲铭, 顾华欣, 刘力宁, 徐雨萌, 乔忠良, 高欣. C-mount封装激光器热特性分析与热沉结构优化研究[J]. 发光学报, 2017, 38(7): 891. ZHANG Xiao-lei, BO Bao-xue, ZHANG Zhe-ming, GU Hua-xin, LIU Li-ning, XU Yu-meng, QIAO Zhong-liang, GAO Xin. Thermal Characteristics Analysis of C-mount Sink Package Laser and Optimization of Heat Sink Structure[J]. Chinese Journal of Luminescence, 2017, 38(7): 891.