根据固体激光器抽运的技术要求，设计了一种具有水冷装置的大功率半导体激光器二维阵列模块，并对半导体激光器热沉和致冷系统的热流进行了分析。在不同占空比下，对该模块进行了测试与分析。该模块的中心波长为810 nm，光谱半峰全宽(FWHM)为2.5 nm，工作电流为110 A(200 μs，10%占空比)，循环水温为15 ℃时输出峰值功率为280 W。结果表明，该封装结构在占空比小于5%时器件工作特性良好，在10%占空比下也可正常工作。利用该模块可以组合成多种几何结构、功率更高的半导体激光器组件。

According to the requirement of pumping solid-state laser, a high power semiconductor laser module is designed and fabricated in 2D arrays with cooling water channel. The temperature field of the heatsink and the cooling structure are analyzed. The module is tested and analyzed at different duty cycle. The typical measured characteristics are as follows: the center wavelength is 810 nm, the FWHM of linewidth is 2.5 nm, and its output peak power is 280 W at driven current of 110 A with pulse width of 200 μs and duty cycle of 10%, and with the cooling water temperature of 15 ℃. Characterization of the laser indicates that the packaging structure can ensure the device works with satisfactory performances under duty cycle of 5% and below, and also working well at duty cycle up to 10%. The results also show that higher power laser module can be packaged with a multifold structure of the same design.