为实现在玻璃基体上直接制造电路的封装技术,采用真空蒸发法在玻璃上镀涂不同厚度的铜膜;运用ANSYS软件模拟计算镀铜玻璃焊接时的瞬态温度场及瞬态应力场分布;利用纳秒紫外激光进行焊接实验;观察测试了焊接接头形貌和力学性能。理论计算表明:当焊接电流强度为27 A时,焊接样品铜膜的平均温度大约为3000 ℃,铜膜气化速率缓慢,焊接效果较好;热应力集中在铜膜上,玻璃的热应力小于玻璃的理论强度,其中焊接速度为70 mm/s时,热应力最小;铜膜厚度为80 nm的焊接样品的抗拉强度最高,为14.34 MPa。由此可得到激光焊接的最佳工艺参数:焊接电流为27 A,焊接速度为70 mm/s,铜膜厚度为80 nm。

Glass was coated with copper films of different thicknesses by the vacuum evaporation method to realize the packaging technology for circuit manufacturing directly on glass substrate. Transient temperature and stress fields during welding of copper-plated glass were calculated using the ANSYS software. Welding experiments were conducted using a nanosecond ultraviolet laser, and the morphology and mechanical properties of welded joints were observed and tested. Theoretical calculations show that when the welding current intensity is 27 A, the average temperature of the copper film of the welding sample is approximately 3000 ℃, and the gasification speed of the copper film is slow; therefore, the welding effect is better. Thermal stresses are concentrated in the copper film whereas the thermal stress of glass is less than its theoretical strength. When the welding speed is 70 mm/s, the thermal stresses are the least. A copper film of thickness of 80 nm gives the highest welding sample tensile strength of 14.34 MPa. The optimal parameters of the laser welding process are the welding current intensity of 27 A, welding speed of 70 mm/s, and copper film thickness of 80 nm.