与传统激光加工技术相比, 水导激光加工技术有着很多优势。根据水导激光加工的特点, 对半导体单晶Si片建立了水导激光打孔的热力学模型, 基于ANSYS二次开发语言apdl对其进行了加工过程的温度场和应力场的仿真, 并与有着相同激光参数的传统激光打孔进行对比。结果表明, 水导激光加工冷却更快, 由于水的强冷却作用, 水导激光打孔产生的热影响区更小, 用仿真的方法直接证明了水导激光打孔产生的热应力更少。

Compared with the traditional laser processing technology, water-guided laser processing technology has many advantages. Based on the characteristics of water-guided laser processing, a thermodynamic model of water-guided laser drilling is established for semiconductor monocrystalline silicon. Based on ANSYS secondary development language apdl, the temperature field and stress field of the machining process are simulated and compared with the traditional laser drilling with the same laser parameters. The results show that the water-guided laser is cooled more rapidly, and the heat-affected zone is small due to the strong cooling effect of water. The simulation results show that water-guided laser drilling produces less thermal stress.