为获得具有高出光效率、高导热性能的发光二极管(LED)封装基板,采用直接敷铝(Al)工艺制备了铝/氧化铝(Al2O3)复合陶瓷基板并对其表面进行化学机械抛光处理。运用光学模拟软件Tracepro和热学模拟软件ANSYS对该陶瓷基板封装的LED光源的光学性能和热学性能进行了模拟计算,并和传统氧化铝陶瓷基板封装的LED光源进行了对比分析,最后将所制备的铝/氧化铝陶瓷基板封装成板上芯片直装(COB)型LED光源进行测试。模拟和实验测试结果均表明:直接敷铝工艺制备的铝/氧化铝陶瓷基板热传递速度更快,导热性能更加优异,更适合用于大功率LED光源的封装;铝/氧化铝陶瓷基板封装的的LED光源比基于传统氧化铝陶瓷基板的LED光源的光通量大,出光效率更高。

To obtain light emitting diode (LED)-packaged substrate with high luminous efficiency and high thermal conductivity, the direct aluminum (Al) plating technology is used to prepare aluminum/aluminum oxide (Al2O3) composite ceramic substrate whose surface is also polished by chemical-mechanical method. The optical and thermal performance of the LED light source packaged by this composite substrate are simulated by using the optical simulation software Tracepro and the thermal simulation software ANSYS. This LED light source is also compared with the traditional alumina ceramic substrate package LED light source. Finally, the prepared aluminum/alumina ceramic substrate is packaged into an on-board chip-mounted (COB) type LED light source for testing. Both results of simulation and experimental tests show that the aluminum/alumina ceramic substrate prepared by direct aluminum process has faster heat transfer rate, better thermal conductivity and it is more suitable for high power LED light source packaging. LED packaged by Al/Al2O3 ceramic substrate has bigger luminous flux and higher luminous efficiency, compared with the light source packaged by traditional Al2O3 ceramic substrate.