以糠醛和壳寡糖反应生成的席夫碱, 与不同摩尔比的Cu2+配位合成配合物FCOS-Cu11、FCOS-Cu13和FCOS-Cu31, 并研究配合物与DNA之间的作用机制。采用循环伏安、紫外-可见吸收光谱、粘度和DNA熔点测定的方法, 分别研究了席夫碱及配合物与DNA之间的作用机制。合成的3种配合物具有电化学活性。加入DNA后, 配合物的氧化峰电流减小, 峰电位微弱移动。配合物的吸收峰强度减色显著, 同时伴有峰位红移现象。配合物加入后, DNA的相对粘度和熔点呈增大趋势。结果表明, 席夫碱及配合物与DNA之间存在嵌插结合, 且3种配合物中的Cu2+含量与DNA的嵌插作用强度有关, 结合强度依次为FCOS-Cu11>FCOS-Cu13> FCOS-Cu31。

Schiff base was synthesized by the reaction of oligochitosan with furfuraldehyde, and acted it as ligand to prepare different molar Schiff base copper complexes which possessed electrochemical activity. The action mechanism of the complex and DNA was studied by spectrometry, viscosity measurement, cyclic voltammeiry and melting point experiment. The results indicate that the reaction of central Cu2+ at glassy carbon electrodes is controlled by diffusion process mechanism. The intensity of the maximal absorption peaks of the complexes is weakened with the increasing of DNA concentration, and the oxidation peak current is decreased but no new redox peak appeared. At the same time, the viscosity and melting point of DNA are increased. There are intercalation action between the complex and DNA, and DNA-binding ability order is FCOS-Cu11>FCOS-Cu13>FCOS-Cu31.