在利用CO₂激光器去除绝缘层的基础上,采用YAG激光器去除线缆屏蔽层材料,建立了YAG激光剥离金属材料的理论模型。利用ANSYS软件对激光剥离材料过程进行数值模拟分析,确定了实验所需参数。通过YAG激光对RG113线缆屏蔽层进行了剥离实验,得到了激光功率、扫描速度、脉宽及离焦量对切口宽度和深度及表面质量的影响规律。通过正交实验的极差分析,研究了各工艺参数对切口宽度和深度的影响。结果表明,激光功率对绝缘层切口宽度、切口深度及金属屏蔽层切口深度的影响最强,而激光扫描速度对金属屏蔽层切口宽度的影响最大。

Based on the removal of insulating layers by CO2 lasers, the shielding layer material of cables is removed by YAG lasers, and the theoretical model of YAG laser peeling of metallic materials is established. The process of laser peeling of materials is simulated and analyzed by ANSYS software, and the experimental parameters are determined. With the experiment of YAG laser peeling of the shielding layers of RG113 cables, the influence rules of laser power, scanning speed, pulse width and defocusing distance on the incision width, the incision depth and the surface quality are obtained. With the range analysis of the orthogonal tests, the influences of different process parameters on the incision width and depth are studied. The results show that the laser power has the greatest impact on the incision width, the incision depth of insulating layers and the incision depth of the metallic shielding layer, while the laser scanning speed has the greatest impact on the incision width of the metallic shielding layer.