光学与光电技术, 2017, 15 (6): 29, 网络出版: 2018-01-09   

机载光电侦察吊舱综合信息处理技术发展与分析

Development and Analysis of Synthetic Information Process Technology for Airborne Electro-Optical Reconnaissance Pod
作者单位
华中光电技术研究所—武汉光电国家实验室, 湖北 武汉 430223
摘要
机载光电侦察吊舱为各类侦察应用提供了数据保障,应用需求也从传统的可见光/红外目标跟踪、有源定位、地理跟踪、火炮校射发展到无源定位,并进一步拓展到辅助着舰/着陆、广域探测、多目标记忆跟踪、机器学习与目标智能识别、视觉辅助导航等多项应用领域,机载光电侦察吊舱已经成为了一种高度集成的目标深度侦察工具。对上述应用领域的相关技术现状和发展进行了归纳和总结,指出并分析了当前机载光电侦察吊舱综合信息处理技术领域存在的主要突出问题,包括海量数据与计算资源有限的矛盾、多传感器综合应用深度尚浅、综合信息的误差分析及仿真评估不充分,而未来综合信息处理技术应朝着智能化、标准化和工程化等方向发展,才能有效提高情报搜集和处理效率,进而充分挖掘出机载光电侦察吊舱的应用潜力。
Abstract
Airborne electro-optical reconnaissance pod can provide data protection for reconnaissance applications. Its application field ranges from the traditional fields such as visible light/infrared tracking, active localization, geographic tracking, fire adjustment, to new expanded fields such as passive localization, auxiliary landing, wide area detection, multi targets tracking, machine learning and intelligent identification, visual navigation aids etc. Now, airborne electro-optical reconnaissance pod has become to be a highly integrated tool for target deep reconnaissance. In this paper, the relevant technology of the application fields above are summarized and current problems in the field of synthetic information processing technology are analyzed for airborne electro-optical surveillance pod, including the contradiction between huge data and limited computing resource, low quantitative multi-sensor application, non-sufficient error analysis and simulation evaluation. The future synthetic information processing technology should be developed towards intellectualized, standardized, and practical in order to improve the efficiency of information collection and processing, and exploit the application potential of airborne electro-optical reconnaissance pod.

李伦平, 刘达. 机载光电侦察吊舱综合信息处理技术发展与分析[J]. 光学与光电技术, 2017, 15(6): 29. LI Lun-ping, LIU Da. Development and Analysis of Synthetic Information Process Technology for Airborne Electro-Optical Reconnaissance Pod[J]. OPTICS & OPTOELECTRONIC TECHNOLOGY, 2017, 15(6): 29.

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