将氮化铝陶瓷片局部嵌入FR4材料中获得嵌埋陶瓷散热基板,结合LED相关测试手段对比研究了其与普通MCPCB对白光LED光学特性的影响。将嵌埋陶瓷散热基板应用于功率为30 W的远近一体车灯光源, 并对LED车灯光源进行了光衰测试以及可靠性验证。结果表明, 嵌埋陶瓷散热基板较之普通MCPCB有着更好的散热性能, FR4/AlN界面呈现出良好的结合强度, 可以大幅减小LED的结温, 有效改善LED的光学性能, 极大地提升LED汽车灯光源的性能稳定性。

Ceramic-embedded heat dissipation substrate was prepared employing AlN block embedded selectively into FR4 material. A comparison study on LEDs optical characteristic was carried out between aforementioned substrate and regular MCPCB using LED-related test method. Ceramic-embedded heat dissipation substrate was used on a 30 W far and near integrated functional LED automobile lamp, with its light failure and reliability were investigated. It was found that the ceramic-embedded heat dissipation substrate was endowed with unparalleled heat dissipation performance in comparison with regular MCPCB and the FR4/AlN interface presented an excellent bonding strength, which could dramatically decrease the junction temperature of LED and improve LEDs optical performance, thus enhancing the performance stability of LED automobile lamp.