红外, 2021, 42 (8): 13, 网络出版: 2021-09-08  

底涂剂在大面阵红外探测器粘接工艺中的应用研究

Application of Primer in Bonding Process of Large Area Array Infrared Detector
作者单位
华北光电技术研究所, 北京 100015
摘要
硅橡胶粘接剂具有良好的耐低温性能, 因此常被用于制冷型红外探测器复合基板的粘接工艺。研究了底涂剂对硅橡胶粘接强度的影响。拉伸试验结果表明, 直接粘接的试样在液氮温度下的平均粘接强度为4.07 MPa, 而使用底涂剂预处理的试样的平均粘接强度则达到6.34 MPa。另外, 通过观察拉伸试样断口, 发现使用底涂剂预处理的试样的断口表面有更多的硅橡胶残留。因此, 使用底涂剂预处理可以有效地增加硅橡胶的粘接强度, 有助于提高红外探测器的可靠性。
Abstract
Silicone rubber adhesive has good low temperature resistance, so it is often used in the bonding process of composite substrate of cooled infrared detector. The effect of the primer on the bonding strength of silicone rubber was studied. The tensile results show that the average bonding strength of the sample directly bonded was 4.07 MPa at liquid-nitrogen temperature, while the average bonding strength of the sample pretreated with the primer reached 6.34 MPa. In addition, by observing the fracture surface of tensile sample, it is found that more silicon rubber remained on the fracture surface of the sample pretreated with the primer. Therefore, pretreatment with the primer can effectively improve the bonding strength of silicone rubber, which is helpful to improve the reliability of infrared detectors.

赵璨, 刘伟, 王冠, 袁羽辉. 底涂剂在大面阵红外探测器粘接工艺中的应用研究[J]. 红外, 2021, 42(8): 13. ZHAO Can, LIU Wei, WANG Guan, YUAN Yu-hui. Application of Primer in Bonding Process of Large Area Array Infrared Detector[J]. INFRARED, 2021, 42(8): 13.

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