激光直写技术因具有灵活的三维微纳结构加工制造能力，在工业以及各个科学领域中得到广泛应用，但要进入亚100 nm乃至亚50 nm尺度，实现高通量的三维纳米制造还是当前的技术难题。而这在后摩尔时代光电混合集成与多层堆叠集成高度发展的今天显得极为重要。从光学成像的角度，这个问题的核心就是要获得大视场和高分辨信息，即信息带宽积的最大化，在激光直写技术中，就是要实现高通量和高分辨刻写。本文将论述激光直写技术的发展，介绍本课题组在高通量激光纳米直写方向的研究进展。

Laser direct writing (LDW) technique has been widely used in various scientific fields because of its flexible 3D micro/nano-structure processing and manufacturing capability. Due to the diffraction limit, it is challenge to get sub 100 nm or sub 50 nm resolution and realize high throughput 3D nano-manufacturing, which is critical important for the integrated circuit industrial applications in the post-Moore law period. From the perspective of optical imaging, it is concerning with superresolution imaging with large field of view, i.e., maximum throughput spatial passband product. LDW technique focuses on writing with high throughput and high resolution. This paper will expound on the development of the LDW technique and introduce our research group's progress in the high throughput LDW technique.