利用1 066 nm光纤激光晶圆标识系统开展晶圆标识工艺的研究, 通过控制变量法分别改变占空比、脉宽在晶圆表面标识SEMI T7码, 利用数码显微系统进行Dot形貌评估, 采用读码器进行读码测试。结果表明, 1 066 nm波长激光标识晶圆时有较宽的工艺窗口, 占空比10%~22%范围内Dot点形貌光滑、无飞溅; 脉宽对Dot点的形貌影响较大, 但是经读码器硬件和软件处理、优化后, 对读取时间影响较小。在占空比10%~22%及脉宽100~300 ns范围内, 均可以得到无飞溅、标识均匀、符合SEMI标识要求的标识。

In this paper, the 1 066 nm fiber laser wafer identification system is used to carry out the research of wafer identification process. The duty ratio and pulse width are respectively changed by the control variable method to mark SEMI T7 code on the wafer. The Dot morphology is observed by the digital microscopic system, and the code reader is used for reading test. Results show that there was a wide process window for 1 066 nm laser identification wafer, and the Dot morphology was smooth and spatter free in the duty ratio range of 10%~22%. The pulse width has a great influence on the Dot morphology, but it has little influence on the read time after the hardware and software processing and optimization of the reader. Within the duty ratio of 10%~22% and pulse width of 100~300 ns, no splash, uniform identification can be obtained, which meets the SEMI identification requirements.