中国激光, 2010, 37 (8): 2143, 网络出版: 2010-08-13   

铝锂合金薄板半导体激光弯曲成形试验研究

Experimental Study of Thin Aluminum-Lithium Alloy Sheet Metal Laser Forming with Semiconductor Laser
作者单位
江苏大学 机械工程学院,江苏 镇江 212013
摘要
金属板材的激光弯曲成形是一种新型非接触、无模和无外力、无回弹的柔性成形方法,其弯曲过程受到许多工艺因素的影响。以航空用铝锂合金薄板为研究对象,用半导体激光器对影响板材激光弯曲成形的主要因素进行了系统的试验研究。研究结果表明,在其他工艺参数一定的条件下,弯曲角度随着激光功率、扫描次数、板材宽度的增大而增大;随着扫描速度的增大,弯曲角度先增大后减小;随着扫描线距自由端的增大,弯曲角度先减小后增大;随着光斑直径的增大,弯曲角度先减小,后增大,再减小;随着板材厚度的增大,弯曲角度减小。
Abstract
Laser forming of sheet metal is a new sheet metal forming process with the features of non-contact,dieless,spring-back free,and high degrees of flexibility. The bending process is affected by many factors. A thin aluminum-lithium alloy sheet metal used in aircraft is chosen as the object of the research and systematic experimental study is conducted with a semiconductor laser to investigate the effect of principal factors that influence laser forming. The experimental results reveal that,under the condition that other technological parameters are invariable,the bending angle increases with the increase of the laser power,number of scan,and sheet width. With the increase of laser scan speed,the bending angle increases at first,and then decreases. As the scan line from the free edge increases,the bending angle decreases at first,and then increases. With the increase of laser beam diameter,the bending angle decreases at first,then increases and finally decreases. The bending angle decreases with the increase of the sheet thickness.

丁磊, 刘会霞, 王鹤军, 王霄. 铝锂合金薄板半导体激光弯曲成形试验研究[J]. 中国激光, 2010, 37(8): 2143. Ding Lei, Liu Huixia, Wang Hejun, Wang Xiao. Experimental Study of Thin Aluminum-Lithium Alloy Sheet Metal Laser Forming with Semiconductor Laser[J]. Chinese Journal of Lasers, 2010, 37(8): 2143.

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