为了保证空间相机电控机箱在轨运行期间的工作温度满足使用要求，根据电控机箱的结构特点和导热路径，对电控机箱内部大功耗电子元器件进行了详细热控设计，解决了某些电子元器件发热量大、导热路径较长的问题。以某个典型元器件为例，进行了散热效果估算。最后应用有限元分析软件IDEAS-TMG建立了详细的电控机箱热分析有限元模型，根据电控机箱所处温度边界条件进行了稳态仿真分析，给出了电控机箱整体的热响应性能、印制线路板(PCB)及板上大功耗电子元器件的稳态温度分布云图，结果显示，PCB的温度为40.6～51.1 ℃，板上大功耗电子元器件的结温为46.3～62.5 ℃，均满足热控设计的指标要求。热分析结果表明电控机箱热设计合理可行，能够满足使用要求。

To ensure the operating temperature of electronic controlling cabinet in a space camera to satisfy the operating requirements, the thermal design of large power consumption electronic components in the electronic controlling cabinet was performed according to the design feature and heat transfer path of the controlling cabinet. The key problems such as the great heat-producing capability and long heat transfer path were settled. On the basis of the above, a complete thermal design scheme was given. By taking some classical elements for examples, the effect of heat eliminating was estimated. In the end, a thermal analysis finite element model was established by a finite element thermal analysis software IDEAS-TMG. Based on the given temperature boundary condition, the steady-state thermal analysis of electric cabinet was carried out by the IDEAS-TMG, and the integral thermal response performance of electronic controlling cabinet and the steady-state temperature profiles of PCBs and large power consumption elements were given. It is shown that the ranges of temperatures of PCBs and large power consumption electronic components in steady-state thermal analysis are 40.6-51.1 ℃ and 46.3-62.5 ℃, respectively, which reaches the target of thermal design. Analytical results indicate that the thermal design scheme for the electronic controlling cabinet is appropriate and feasible and it can satisfy the requirement of thermal control operating.