针对高功率二极管激光器的封装要求，通过磁控溅射的方法制备了Au80Sn20合金焊料，使用扫描电子显微镜(SEM)观察其微结构和表面形貌；利用能谱仪(EDX)和X射线荧光测试仪分析其成分；采用差热分析法(DTA)测试其熔化温度，并用制备的Au80Sn20合金焊料进行了可焊性实验。结果表明：磁控溅射法可以制备Au80Sn20合金焊料，其制备的Au80Sn20合金焊料表面无明显缺陷，结构致密；成分与理论值接近；熔点与理论熔点接近；焊接浸润性好,空洞率小,强度大。

For the packaging demand of high power diode laser, the method of magnetron sputtering was used to fabricate the Au80Sn20 alloy solder. A scanning electron microscope (SEM) was adopted to observe its microstructure and surface topography, an energy dispersive X-ray detector(EDX) to test its composition, and the differential thermal analysis (DTA) to test its melting temperature. The weldability of the Au80Sn20 alloy solder was analyzed by reflow soldering process. In conclusion, using magnetron sputtering can successfully manufacture the Au80Sn20 alloy solder. The prepared Au80Sn20 alloy solder features compact surface structure, easy wetting, small void content, and large bonding strength. Its composition and melting point are close to the theoretical situation.