采用飞秒激光切割和微细电阻滑焊组合的方法制备了高深宽比的三维微结构。为了提高每层二维微结构的叠加精度和连接强度，用逐层微细电阻滑焊对每层二维微结构进行滑焊以获得较好的工艺参数。对上述工艺参数所制备的微结构进行了抗剪切能力测试，测试结果显示：随着滑焊放电次数的增加，微结构的极限剪切力由8.04 N 逐渐增加至65.97 N。而后，通过能量分散光谱仪（EDS）对电极的沉积效应进行了研究。最后，在120 mW的飞秒激光，50 μm/s的切割速度，0.21 V的焊接电压，0.2 MPa的焊接压强，100 ms的预压时间，10 ms的焊接时间以及160次的滑焊放电次数等工艺参数下制备了基本尺寸为50 μm×50 μm的微方孔阵列以及微齿轮结构。实验结果表明：通过逐层微细电阻滑焊制备的微结构表面质量良好，各层微结构之间叠加较好，显示逐层微细电阻滑焊可以较好地保证三维微结构中各层二维微结构的连接强度和叠层精度。

A 3D microstructure with a high depthtowidth ratio was fabricated by combining femtosecond laser cutting and microelectric resistance slip welding. To improve laminated precision and connection strength of every layer 2D microstructure, the layerbylayer microelectric resistance slip welding was used for every layer 2D microstructure to obtain a better technological parameters. Under above process parameters, the antishear ability of 3D microstructure was tested. The test results indicate that with the number of the slip welding discharges increasing, the yield shear stress of microstructure increases from 8.04 N to 65.97 N.Then, the deposition effect of the tungsten bar electrode produced during layerbylayer microelectric resistance slip welding was also studied through the Energy Dispersive Spectrometer(EDS)analysis.Finally, micro array square holes with a size of 50 μm×50 μm and a microgear cavity were processed after 160 time’s slip welding discharge under a femtosecond laser power of 110 mW, a cutting speed of 50 μm/s, a welding voltage of 0.21 V,welding time of 10 ms,and a welding pressure of 0.2 MPa.The fabrication results show that the 3D microstructures processed by the layerbylayer microelectric resistance slip welding have good surface quality and the superposition between the layers of microstructure.Therefore, layerbylayer microelectric resistance slip welding can guarantee the connection strength and laminated precision of every layer 2D microstructure.