Chinese Optics Letters, 2015, 13 (8): 081403, Published Online: Sep. 14, 2018  

Modeling of dynamic process in the laser-off period during laser drilling Download: 703次

Author Affiliations
School of Science, Nanjing University of Science and Technology, Nanjing 210094, China
Figures & Tables

Fig. 1. Scheme of numerical model.

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Fig. 2. (a) Numerical and (b) experimental comparisons of the keyhole shape with a laser energy of 4.86 J. The white bar represents 0.5 mm.

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Fig. 3. Image sequences of the keyhole fabricated by a single laser pulse with a laser energy of 4.86 J in both the laser-on and -off periods. The white bar represents 1 mm.

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Fig. 4. Temperature distributions of the keyhole fabricated by a single laser pulse with a laser energy of 4.86 J in both the laser-on and -off periods. The white bar represents 1 mm.

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Fig. 5. Velocity distributions of the keyhole fabricated by a single laser pulse with a laser energy of 4.86 J in both the laser-on and -off periods. The white bar represents 1 mm.

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Table1. Properties of Aluminum and Constants in Simulation.[22,23]

Nomenclature (unit)SymbolValue
Melting/evaporation temperature (K)Tm/Tv933/793
Solid/liquid density (kg/m3)ρs/ρl2702/2385
Solid/liquid specific heat (J/m/K)cs/cl917/1080
Solid/liquid conductivity (W/m/K)ks/kl237/100
Latent heat of fusion/evaporation (J/kg)Lm/Lv3.6×105/1.09×107
Temperature coefficient of surface tension (N/m/K)σT0.3×103
Dynamic viscosity (Pa s)μ1.6×103
Convective heat transfer coefficient (W/m2/K)hc20
Radiation emissivity (W/m2/K4)ε0.2
Absorption coefficientη0.26
Stefan–Boltzmann constant (W/m2/K4)σs5.67×108
Focal radius (μm)/Pulse width (μs)r0/τ300/1000

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Table2. Numerical and Experimental Data for Both Keyhole Depth and Width.

Energy (J)Deptha (mm)Depthb (mm)Diametera (mm)Diameterb (mm)
1.220.8940.9020.5180.523
2.071.3221.3130.7520.741
3.131.4481.4200.8240.817
4.861.5231.5100.8720.870
6.312.0702.1090.8630.875
8.012.7452.6930.9010.920
10.203.1203.1310.9430.958
13.273.4393.3571.0521.046

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Tingzhong Zhang, Xiaowu Ni, Jian Lu. Modeling of dynamic process in the laser-off period during laser drilling[J]. Chinese Optics Letters, 2015, 13(8): 081403.

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