International Journal of Extreme Manufacturing, 2020, 2 (1): , Published Online: --  

Deformation and removal of semiconductor and laser single crystals at extremely small scales

Author Affiliations
Basic Information
DOI: 10.1088/2631-7990/ab7a2a
中图分类号: --
栏目: Topical Review
项目基金: The authors would like to acknowledge the financial supports from Australia Research Council (ARC) under Discovery Projects program (DP180103275). It is also supported by the Scientific Research Funds of Huaqiao University (605- 50Y19022). Certain images in this publication have been obtained by the author(s) from the Wikipedia/Wikimedia website, where they were made available under a Creative Commons licence or stated to be in the public domain. Please see individual captions in this publications for details. To the extent that the law allows, IOP Publishing disclaim any liability that any person may suffer as a result of accessing, using or forwarding the image(s). Any reuse rights should be checked and permission should be sought if necessary from the Wikipedia/Wikimedia and/or the copyright owner (as appropriate) before using or forwarding the image(s).
收稿日期: Dec. 30, 2019
修改稿日期: Feb. 26, 2020
网络出版日期: --
通讯作者:
备注: --

. Deformation and removal of semiconductor and laser single crystals at extremely small scales[J]. International Journal of Extreme Manufacturing, 2020, 2(1): .

关于本站 Cookie 的使用提示

中国光学期刊网使用基于 cookie 的技术来更好地为您提供各项服务,点击此处了解我们的隐私策略。 如您需继续使用本网站,请您授权我们使用本地 cookie 来保存部分信息。
全站搜索
您最值得信赖的光电行业旗舰网络服务平台!