International Journal of Extreme Manufacturing, 2020, 2 (1): , Published Online: --
Deformation and removal of semiconductor and laser single crystals at extremely small scales
Basic Information
DOI: | 10.1088/2631-7990/ab7a2a |
中图分类号: | -- |
栏目: | Topical Review |
项目基金: | The authors would like to acknowledge the financial supports from Australia Research Council (ARC) under Discovery Projects program (DP180103275). It is also supported by the Scientific Research Funds of Huaqiao University (605- 50Y19022). Certain images in this publication have been obtained by the author(s) from the Wikipedia/Wikimedia website, where they were made available under a Creative Commons licence or stated to be in the public domain. Please see individual captions in this publications for details. To the extent that the law allows, IOP Publishing disclaim any liability that any person may suffer as a result of accessing, using or forwarding the image(s). Any reuse rights should be checked and permission should be sought if necessary from the Wikipedia/Wikimedia and/or the copyright owner (as appropriate) before using or forwarding the image(s). |
收稿日期: | Dec. 30, 2019 |
修改稿日期: | Feb. 26, 2020 |
网络出版日期: | -- |
通讯作者: | |
备注: | -- |
. Deformation and removal of semiconductor and laser single crystals at extremely small scales[J]. International Journal of Extreme Manufacturing, 2020, 2(1): .