非金属材料红外无损检测的建模和数值分析

牛奕; 马云; 李明明; 张英

红外技术, 2019, 41 (3): 214, 网络出版: 2019-04-05

非金属材料红外无损检测的建模和数值分析

Modeling and Numerical Analysis of Infrared Nondestructive Testing of Non-metallic Materials

论文大纲

牛奕 ^*马云李明明张英

作者单位

武汉理工大学资源与环境工程学院, 湖北武汉 430070

红外无损检测非金属建模温度梯度 infrared nondestructive testing non-metal modeling temperature gradient

摘要

利用 ANSYS模拟建立二维、三维非金属材料非稳态导热模型, 采用红外热源作为激励, 非金属材料粘贴缺陷无损检测过程。在缺陷深度一定, 不同缺陷厚度和面积条件下, 二维模拟得到非金属材料表面温度, 并计算温度梯度。分析温度梯度与缺陷厚度和半径的关系, 提出确定缺陷边界和厚度的方法; 建立 3种不规则形状缺陷, 通过三维模拟结果, 验证二维模拟提出的确定缺陷边界和厚度方法的可行性。结果表明: 在缺陷半径一定时, 缺陷厚度与温度梯度峰值呈线性关系; 缺陷半径大于 10 mm, 缺陷厚度与温度梯度峰值线性度基本相同; 温度梯度峰值的位置与缺陷边界基本一致。

Abstract

Two-dimensional and three-dimensional unsteady heat conduction models were established. The infrared heat source was used as the excitation, and ANSYS was used to simulate the nondestructive testing process of non-metallic materials. Under the condition that the defect depth was certain and the thickness and area of the defect were different, the surface temperature of the non-metal material was obtained by two-dimensional simulation, and the temperature gradient was calculated. The relationship between the temperature gradient and the thickness and radius of the defect was analyzed. The method of determining the boundary and thickness of the defect was put forward. Three kinds of irregular-shaped defects were established. The feasibility of the method for determining the boundary and thickness of the defect was verified by the three-dimensional simulation results. The results showed that the defect thickness had a linear relationship with the peak temperature gradient when the defect radius was fixed, and the defect radius was greater than 10mm. The defect thickness was similar to the temperature gradient, and the position of the peak temperature gradient was similar to the defect boundary.

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牛奕, 马云, 李明明, 张英. 非金属材料红外无损检测的建模和数值分析[J]. 红外技术, 2019, 41(3): 214. NIU Yi, MA Yun, LI Mingming, ZHANG Ying. Modeling and Numerical Analysis of Infrared Nondestructive Testing of Non-metallic Materials[J]. Infrared Technology, 2019, 41(3): 214.

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