超细钼丝亚硫酸盐脉冲镀金实验研究

章志敏; 刘德斌; 杨向东; 邱龙会; 付志兵; 余斌

强激光与粒子束, 2005, 17 (7): 1027, 网络出版: 2006-04-28

超细钼丝亚硫酸盐脉冲镀金实验研究

Gilt molybdenum wire for Z-pinch experiment by sulfite pulse gilding technique

论文大纲

章志敏 ^1,2刘德斌 ²杨向东 ¹邱龙会 ^2,*付志兵 ²余斌 ²

作者单位

¹ 四川大学原子与分子物理研究所,四川,成都,610064

² 中国工程物理研究院激光聚变研究中心,四川,绵阳,621900

钼丝镀层脉冲镀金结合力 Molybdenum wire Plating layer Pulse gilding Bind-force Z-pinch Z-pinch

摘要

超细钼丝是Z-pinch物理实验常用的材料之一.采用亚硫酸脉冲镀金技术,在超细钼丝上镀制一层均匀致密的金层来改善钼丝性能.实验研究和优化了影响镀层质量和沉积效率的主要工艺条件,优化后的阴极电流密度2 mA/cm₂,溶液pH值8.5,溶液温度40°.用扫描电镜观察镀金钼丝的表面形貌及镀层质量;用划痕法测试了镀层与钼丝表面的结合力.实验结果表明,采用经过优化的镀金工艺能够在直径小于15 μm的钼丝上镀制厚度0.6～2.5 μm的致密金层,且能够有效地降低钼丝表面的粗糙度和提高抗氧化能力,满足Z-pinch实验的需要.

Abstract

The ultra-fine molybdenum wire is often used for Z-pinch experiment. To improve the performance of the molybdenum wire, the sulfite pulse gilding technique was used to plate a compact gold layer on the wire. The technological conditions were optimized to ensure the surface quality of the molybdenum wire, including the cathode current density being 2 mA/cm₂, the pH value of the solution being 8.5, and the temperature of the solution being 40 ℃. The surface of the molybdenum wire was observed by a scan electron microscope. The bind-force between the gold layer and the molybdenum wire was tested with the nick method. The results show that with the optimized technique the molybdenum wire of less than 15 μm in diameter can be plated with a gold layer of 0.6~2.5 μm thick and the gilt molybdenum wire satisfies the requirements of the Z-pinch experiment.

参考文献

[1] 宁成,杨震华,丁宁. Z箍缩丝阵负载参数的优化设计[J]. 强激光与粒子束, 2003, 15(12):1200-1204.
Ning C, Yang Z H, Ding N. Optimal design on parameter of Z-pinch wire-array load. High Power Laser and Particle Beams, 2003, 15(12):1200-1204.

[2] 魏芸,邱龙会,唐永建,等. Z-pinch靶的结构及材料特点[J]. 强激光与粒子束, 2001, 13(5):568-572.
Wei Y, Qiu L H, Tang Y J, et al. Characteristics of Z-pinch targets and related materials. High Power Laser and Particle Beams, 2001, 13(5):568-572.

[3] 邹小兵,王新新,罗承沐,等. 喷气Z箍缩负载的质量线密度确定[J]. 强激光与粒子束, 2002, 14(3):473-475.
Zou X B, Wang X X, Luo C M, et al. Determination of line mass density for the gas load of a gas puff Z-pinch. High Power Laser and Particle Beams, 2002, 14(3):473-475.

[4] 付志兵,邱龙会,刘德斌,等. 高温高密度Z-pinch等离子体自适应式平面丝阵负载制备技术研究[J]. 强激光与粒子束, 2003, 15(12):1187-1190.
Fu Z B, Qiu L H, Liu D B, et al. Techniques to design and fabricate self-adapted planar wire-arrays used in high-density Z-pinch plasmas. High Power Laser and Particle Beams, 2003, 15(12):1187-1190.

[5] 向国朴. 脉冲电镀的理论与应用[M]. 天津:天津科学技术出版社,1989.1-88.
Xiang G P. The theory and application of pulse electroplating. Tianjin :Tianjin Science and Technology Press, 1989.1-88.

[6] 金建国. 亚硫酸盐光亮镀金[J]. 材料保护, 1998, 31(2):26-27.
Jin J G. Sulfite brightness gild. Material Protection, 1998, 31(2):26-27.

[7] 国家机械工业委员会. 高级电镀工工艺学[M]. 北京:机械工业出版社, 1988.1-61.
National Committee of Mechanical Industry. Advanced galvanizer technology. Beijing: Mechanical Industry Press, 1988.1-61.

[8] 屠振密. 电镀合金原理与工艺[M]. 北京:国防工业出版社,1993.48-52.
Tu Z M. The theory and technology of alloy electroplating. Beijing: National Defence Industry Press, 1988.1-61.

[9] 化学工业部教育培训中心. 电镀[M].北京:化学工业出版社, 1998.2-44.
Educational and Training Center of the Department of Chemical Industry. Electroplating. Beijing: Chemical Industry Press, 1998.2-44.

[10] 屠振密,韩书梅,杨哲龙, 等. 防护装饰性镀层[M]. 北京:化学工业出版社, 2004.87-95.
Tu Z M, Han S M, Yang Z L, et al. Protective and ornamental plating layer. Beijing: Chemical Industry Press, 2004.87-95.

章志敏, 刘德斌, 杨向东, 邱龙会, 付志兵, 余斌. 超细钼丝亚硫酸盐脉冲镀金实验研究[J]. 强激光与粒子束, 2005, 17(7): 1027. ZHANG Zhi-min, LIU De-bin, YANG Xiang-dong, QIU Long-hui, FU Zhi-bing, YU Bin. Gilt molybdenum wire for Z-pinch experiment by sulfite pulse gilding technique[J]. High Power Laser and Particle Beams, 2005, 17(7): 1027.

超细钼丝亚硫酸盐脉冲镀金实验研究

关于本站 Cookie 的使用提示

全站搜索

超细钼丝亚硫酸盐脉冲镀金实验研究

相关论文

相关资讯

关于本站 Cookie 的使用提示

全站搜索