强激光与粒子束, 2016, 28 (6): 064126, 网络出版: 2016-04-12  

内嵌微流道低温共烧陶瓷基板传热性能

作者单位
1 北京大学 深圳研究生院 信息工程学院, 广东 深圳 518055
2 北京信息科技大学 信息微系统研究所, 北京 100101
3 北京大学 微纳电子学研究院, 北京 100871
引用该论文

胡独巍, 缪旻, 方孺牛, 崔小乐, 金玉丰. 内嵌微流道低温共烧陶瓷基板传热性能[J]. 强激光与粒子束, 2016, 28(6): 064126.

Hu Duwei, Miao Min, Fang Runiu, Cui Xiaole, Jin Yufeng. 内嵌微流道低温共烧陶瓷基板传热性能[J]. High Power Laser and Particle Beams, 2016, 28(6): 064126.

参考文献

[1] PetersonK A, Patel K D, Ho C K, et al. Novel microsystem applications with new techniques in low temperature co-fired ceramics[J]. Int J Appl Ceram Tec, 2005, 2(5): 345-363.

[2] Golonka L. Technology and applications of low temperature cofired ceramic (LTCC) based sensors and microsystems[J]. Bull Polish Acad Sci Tech Sci, 2006, 54: 221-231.

[3] Gongora-Rubio M R, Espinoza-Vallejos P, Sola-Laguna L, et al. Overview of low temperature co-fired ceramics tape technology for meso-system technology (MsST)[J]. Sens Actuators A: Phys, 2001, 89: 222-241.

[4] SebastianM T, Jantunen H. Low loss dielectric materials for LTCC applications: A review[J]. Int Mater Rev, 2008, 53(2): 57-90.

[5] Golonka L, Bembnowicz P, Jurków D, et al. Low temperature co-fired ceramics (LTCC) microsystems[J]. Opt Appl, 2011, 41: 383-388.

[6] Asadi M, Xie G, Sunden B. A review of heat transfer and pressure drop characteristics of single and two-phase microchannels[J]. Int J Heat Mass Transfer, 2014, 79 : 34-53.

[7] KhoongL E, Tan Y M, Lam Y C. Overview on fabrication of three-dimensional structures in multi-layer ceramic substrate[J]. J Eur Ceram Soc, 2010, 30(10): 1973-1987.

[8] Thelemann T, Thust H, Bischoff G, et al. Liquid cooled LTCC substrates for high power applications[J]. Int J Microcircuits Electron Packag, 2000, 23(2): 209-214.

[9] Miao Min, Jin Yufeng, Fang Runiu, et al. Investigation of micromachined LTCC functional modules for high-density 3D SIP based on LTCC packaging platform[C]//63rd Electronic Components and Technology Conference (ECTC). 2013: 1815-1822.

[10] Zhang Lanying, Zhang Yangfei, Chen Jiaqi, et al. Fluid flow and heat transfer characteristics of liquid cooling microchannels in LTCC multilayered packaging substrate[J]. Int J Heat Mass Transfer, 2015, 84: 339-345.

[11] Roosen A. New lamination technique to join ceramic green tapes for the manufacturing of multilayer devices[J]. J Eur Ceram Soc, 2001, 21: 1993-1996.

[12] Horvath E, Henap G, Harsanyi G. Finite element modeling of channel sag in LTCC[J]. Microelectron Int, 2012, 29(3): 145-152.

[13] Malecha K, Maeder T, Jacq C. Fabrication of membranes and microchannels in low-temperature co-fired ceramic (LTCC) substrate using novel water-based sacrificial carbon pastes[J]. J Eur Ceram Soc, 2012, 32: 3277-3286.

胡独巍, 缪旻, 方孺牛, 崔小乐, 金玉丰. 内嵌微流道低温共烧陶瓷基板传热性能[J]. 强激光与粒子束, 2016, 28(6): 064126. Hu Duwei, Miao Min, Fang Runiu, Cui Xiaole, Jin Yufeng. [J]. High Power Laser and Particle Beams, 2016, 28(6): 064126.

关于本站 Cookie 的使用提示

中国光学期刊网使用基于 cookie 的技术来更好地为您提供各项服务,点击此处了解我们的隐私策略。 如您需继续使用本网站,请您授权我们使用本地 cookie 来保存部分信息。
全站搜索
您最值得信赖的光电行业旗舰网络服务平台!