基于光电热寿命理论的LED寿命预测模型
[1] M. R. Krames, O. B. Shchekin, R. Mueller-Mach et al.. Status and future of high-power light-emitting diodes for solid-state lighting[J]. J. Display Technol., 2007, 3(2): 160~175
[2] G. Harbers, S. J. Bierhuizen, M. R. Krames. Performance of high power light emitting diodes in display illumination applications[J]. J. Display Technol., 2007, 3(2): 98~109
[3] C. Qian. Thermal management of high-power white LED package[C]. 8th Int. Electron. Packaging Technol., 2007. 1~5
[4] A. Christensen, M. Ha, S. Graham. Thermal management methods for compact high power LED arrays[C]. SPIE, 2007, 6669: 66690Z
[5] N. Narendran, Y. M. Gu. Life of LED-based white light sources[J]. J. Display Technol., 2005, 1(1): 167~171
[6] IEEE. IEEE Standard Methodology for Reliability Prediction and Assessment for Electronic Systems and Equipment [S]. IEEE Standard 1413-1998. New York: IEEE, 1998
[7] 苗洪利, 周晓光, 周长友 等. 发光二极管结温测量的经验模型研究[J]. 光学学报, 2011, 31(s1): s100313
Miao Hongli, Zhou Xiaoguang, Zhou Changyou et al.. Study on empirical model in junction-temperature measurement of LED[J]. Acta Optica Sinica, 2011, 31(s1): s100313
[8] C. Biber. LED light emission as a function of thermal conditions[C]. Semiconductor Thermal Measurement and Management Symposium, 2008. 180~184
[9] S. Y. Hui, Y. X. Qin. A general photo-electro-thermal theory for light emitting diode (LED) systems[J]. IEEE Trans. Power Electron., 2009, 24(8): 1967~1976
[10] B. Foucher, J. Boullié, B. Meslet et al.. A review of reliability prediction methods for electronic devices[J]. Microelectronics Reliability, 2002, 42(8): 1155~1162
[11] J. B. Bowles. A survey of reliability-prediction procedures for microelectronic devices[J]. IEEE Trans. Reliability, 1992, 41(1): 2~12
[12] 余菲, 金雷. GaN发光二极管的老化数学模型及寿命测试方法[J]. 中国激光, 2011, 38(8): 0806001
[13] 吴海彬, 王昌铃. 白光LED封装材料对其光衰影响的实验研究[J]. 光学学报, 2005, 25(8): 1091~1094
[14] LUXEON Rebel Reliability. Reliability Data RD07 [OL]. http:// www.philipslumileds.com/support/documentation/reliability-data
[15] L. Trevisanello, M. Meneghini, G. Mura et al.. Accelerated life test of high brightness light emitting diodes[J]. IEEE Trans. Device and Materials Reliability, 2008, 8(2): 304~311
[16] N. A. A. Karim, P. A. Narayana, K. N. Seetharamu. Thermal analysis of LED package[J]. Microelectronics International, 2006, 23(1): 19~25
[17] 汪延明, 熊传兵, 王光绪 等. 不同基板1 W硅衬底蓝光LED老化性能研究[J]. 光学学报, 2010, 30(6): 1749~1754
[18] 中国人民解放军总装备部. GJB/Z 299B-98. 电子设备可靠性预计手册[S]. 北京: 电子部, 1998
The General Reserve Department of PLA. GJB/Z 299B-98. Reliability Prediction Handbook for Electronic Equipment[S]. Beijing: Electronics Department, 1998
钱敏华, 林燕丹, 孙耀杰. 基于光电热寿命理论的LED寿命预测模型[J]. 光学学报, 2012, 32(8): 0823001. Qian Minhua, Lin Yandan, Sun Yaojie. Life Prediction Model for LEDs Based on the Photo-Electro-Thermal-Life Theory[J]. Acta Optica Sinica, 2012, 32(8): 0823001.