反射式倒装对1 300 nm激光器性能改善的分析
薛正群, 王凌华, 苏辉. 反射式倒装对1 300 nm激光器性能改善的分析[J]. 发光学报, 2018, 39(4): 534.
XUE Zheng-qun, WANG Ling-hua, SU Hui. Analysis The Performance Improvement of 1 300 nm Laser with Reflective Flip Chip Package[J]. Chinese Journal of Luminescence, 2018, 39(4): 534.
[1] HUANG J S, NGUYEN T, HSIN W, et al.. Reliability of etched-mesa buried-heterostructure semiconductor lasers [J]. IEEE Trans. Dev. Mater. Relib., 2005, 5(4):665-674.
[2] HUANG J S, MIAO R S, LU H, et al.. Theoretical and experimental thermal analysis of inp ridge lasers on submounts and TO packages [J]. IEEE Trans. Dev. Mater. Relib., 2007, 7(2):363-368.
[3] HUANG J S, OLSON T, ISIP E. Human-body-model electrostatic-discharge and electrical-overstress studies of buried-heterostructure semiconductor lasers [J]. IEEE Trans. Dev. Mater. Relib., 2007, 7(3):453-461.
[4] HUANG J S, LU H. Size effect on ESD Threshold and degradation behavior of InP buried heterostructure semiconductor lasers [J]. Open Appl. Phys. J., 2009, 2:5-10.
[5] 王淑娜, 张普, 熊玲玲, 等. 温度对高功率半导体激光器阵列“smile”的影响 [J]. 光子学报, 2016, 45(5):7-12.
WANG S N, ZHANG P, XIONG L L, et al.. Influence of temperature on “smile” in high power diode laser bars [J]. Acta Photon. Sinica, 2016, 45(5):7-12. (in Chinese)
[6] 金伟, 李光慧, 陈熙, 等. 一体化半导体激光器的ANSYS热仿真及结构设计 [J]. 光学 精密工程, 2016, 24(5):1080-1086.
[7] KNAUER A, ERBERT G, STASKE R, et al.. High-power 808 nm lasers with a super-large optical cavity [J]. Semicond. Sci. Technol., 2005, 20:621-624.
[8] BUGGE F, ZEIMER U, WENZEl H, et al.. Laser diodes with highly strained InGaAs MQWs and very narrow vertical far fields [J]. Phys. Stat. Sol.(c), 2006, 3(3):423-426.
[9] CRUMP P, PIETRZAK A, BUGGE F, et al.. 975 nm high power diode lasers with high efficiency and narrow vertical far field enabled by low index quantum barriers [J]. Appl. Phys. Lett., 2010, 96:131011-1-3.
[10] ABDULRAHMAN A M, ABDULLAH A, ABDELMAJID S. Waveguide design optimization for long wavelength semiconductor lasers with low threshold current and small beam divergence [J]. J. Modern Phys., 2011, 2:225-230.
[11] 高树理. 半导体激光器和光纤的耦合 [J]. 煤炭技术, 2010, 29(2):28-30.
GAO S L. Coupling of semiconductor laser with fiber [J]. Coal Technol., 2010, 29(2):28-30.
[12] GUO X, SCHUBERT E F. Current crowding and optical saturation effects in GaInN/GaN light-emitting diodes grown on insulating substrates [J]. Appl. Phys. Lett., 2001, 78:3337-3339.
[13] PEARTON S J, ABERNATHY C R, PANISH M B, et al..Implant induced high resistivity regions in InP and In GaAs[J]. J. Appl. Phys, 1989, 66(2):656-662.
[14] FAN Z F, MOHAMMAD S N, KIM W, et al.. Very low resistance multilayer Ohmic contact to n-GaN [J]. Appl. Phys. Lett., 1996, 68(12):1672-1674.
[15] 张晓磊, 薄报学, 张哲铭, 等. C-mount封装激光器热特性分析与热沉结构优化研究 [J]. 发光学报, 2017, 38(7):891-896.
[16] 施敏, 伍国珏. 半导体器件物理 [M]. 西安:西安交通大学出版社, 2008.
SHI M, WU G J. Semicondudor Devices Physics [M]. Xian: Xian Jiao Tong University Press, 2008. (in Chinese)
[17] MELANIE O, SWALES A. Capabilites and reliability of LEDs and laser diodes [J]. Whats New in Electron., 2000, 20(6):1-5.
薛正群, 王凌华, 苏辉. 反射式倒装对1 300 nm激光器性能改善的分析[J]. 发光学报, 2018, 39(4): 534. XUE Zheng-qun, WANG Ling-hua, SU Hui. Analysis The Performance Improvement of 1 300 nm Laser with Reflective Flip Chip Package[J]. Chinese Journal of Luminescence, 2018, 39(4): 534.