[1] 杨志伊.纳米科技[M].北京:机械工业出版社,2004:60-62.(Yang Z Y.Nano-technology.Beijing:China Machine Press,2004:60-62)

[2] 任引哲,蔡世臣,王忠信.表面包覆与纳米微粉的制备及性质[J].山西师范大学学报(自然科学版),1999,13(1):39-41.(Ren Y Z,Cai S C,Wang Z X.Influence of surface integument on the preparation and performance of nanometer fine powders.Journal of Shanxi Teacher's University (Natural Science Edition),1999,13(1):39-41)

[3] 程原,高保娇,梁浩.微米级镀银铜粉复合导电涂层的导电性研究[J].应用基础与工程科学学报,2001,9(2-3):184-190.(Cheng Y,Gao B J,Liang H.Submicroscopic structure and conductive capability of coating film filled by micro-silver coated copper powders.Journal of Basics Science and Engineering,2001,9(2/3):184-190)

[4] 高保娇,高建峰,蒋红梅,等.微米级铜-银双金属粉镀层结构及其抗氧化性[J].物理化学学报,2000,16(4):366-369.(Gao B J,Gao J F,Jiang H M,et al.Plating structure and anti oxygenation of micron Cu-Ag bimetallic powder.Acta Physico-Chimica Sinica,2000,16(4):366-369)

[5] 吴秀华,赵斌,邵佳敏.不同形貌Cu-Ag双金属粉的制备及性能[J].华东理工大学学报,2002,28(4):402-405.(Wu X H,Zhao B,Shao J M.Preparation and properties of Cu-Ag bimetallic powders.Journal of East China University of Science and Technology,2002,28(4):402-405)

[6] 高保娇,蒋红梅,张忠兴.用银氨溶液对微米级铜粉镀银反应机理的研究[J].无机化学学报,2000,16(4):669-674.(Gao B J,Jiang H M,Zhang Z X.Studying on reaction mechanism of silver-plating for micro copper particle.Chinese Journal of Inorganic Chemistry,2000,16(4):669-674)

[7] 刘志杰,赵斌,张宗涛,等.超细核壳铜-银双金属粉的制备[J].无机化学学报,1996,12(1):30-34.(Liu Z J,Zhao B,Zhang Z T,et al.Preparation of ultrafine core-shell Cu-Ag bimetallic powders.Chinese Journal of Inorganic Chemistry,1996,12(1):30-34)

[8] 廖辉伟,李翔,彭汝芳,等.包覆型纳米铜-银双金属粉研究[J].无机化学学报,2003,19(12):1327-1330.(Liao H W,Li X,Peng R F,et al.Study on Ag coating Cu nano bimetallic powders.Chinese Journal of Inorganic Chemistry,2003,19(12):1327-1330)

[9] Li C M,Lei H,Tang Y J,et al.Production of copper nanoparticles by the flow-levitation method[J].Nanotechnology,2004,15(12):1866-1869.

[10] 韦建军,李朝阳,唐永建,等.自悬浮定向流法制备纳米铜微粒及其结构表征[J].强激光与粒子束,2003,15(4):359-362.(Wei J J,Li C Y,Tang Y J,et al.Preparation and granularity control of nano-copper particles by flow levitation method.High Power Laser and Particle Beams,2003,15(4):359-362)