光学学报, 2003, 23 (s1): 607, 网络出版: 2013-01-28
Low-Cost High-Performance 10 G Transmitter and Receiver Optical Subassembly
Low-Cost High-Performance 10 G Transmitter and Receiver Optical Subassembly
摘要
Abstract
We describe briefly here the recent R&D activities in the optical subassembly packaging technologies at the Hong Kong Applied Science and Technology Research Institute (ASTRI). We have designed, developed and prototyped multiple of low-cost high performance packages for serial and parallel transmitters and receivers, in particular, the novel chip-in-plastic (CiP) package designed for 10G serial transmission for data communications.
参考文献
[1] High Speed Electrical Specification XFI, XFP MSA, revision 2002.
K. S. Cheng, E. Cheung, R. Cheung, S. Cheung, A. Chow, C. W. Fan, H. W. Ho, A. Hui, M. W. K. Mak, S. K. Lam, S. L. Lau, K. S. Lee, A. Siu, S. K. Yau, F. Tong. Low-Cost High-Performance 10 G Transmitter and Receiver Optical Subassembly[J]. 光学学报, 2003, 23(s1): 607. K. S. Cheng, E. Cheung, R. Cheung, S. Cheung, A. Chow, C. W. Fan, H. W. Ho, A. Hui, M. W. K. Mak, S. K. Lam, S. L. Lau, K. S. Lee, A. Siu, S. K. Yau, F. Tong. Low-Cost High-Performance 10 G Transmitter and Receiver Optical Subassembly[J]. Acta Optica Sinica, 2003, 23(s1): 607.