双面抛光运动的数学建模及轨迹优化
张彦, 李军, 朱永伟, 高平, 李标, 蒋毕亮, 左敦稳. 双面抛光运动的数学建模及轨迹优化[J]. 光学技术, 2011, 37(3): 279.
ZHANG Yan, LI Jun, ZHU Yongwei, GAO Ping, LI Biao, JIANG Biliang, ZUO Dunwen. Mathematical modeling and trajectory optimization of double-sided polishing process[J]. Optical Technique, 2011, 37(3): 279.
[1] 曹连科,吴志宝.单晶锗双面抛光工艺［J］.光学技术,1985,(2):9-10.
Cao L K, Wu Z B. The double-sided polishing process for single crystal germanium［J］.Optical Technique, 1985,(2):9-10.
[2] 胡晓珍,李伟.超精密双面抛光机结构的优化设计［J］.设计与研究,2009,(3):54-57.
Hu X Z, Li W. Optimized design of ultra-precision double-sided polishing machine［J］.Design and Research,2009,(3):54-57.
[3] 杨建东,田春林,王长兴.高速研磨技术［M］.北京:国防工业出版社,2003:18-34.
Yang J D, Tian C L, Wang C X. High-speed grinding technology［M］. BeiJing:National Defense Industry,2003:18-34.
[4] 库黎明,闫志瑞.300mm硅片双面抛光过程数学模拟及分析［J］.微电子学,2008,38(3):373-376.
Ku L M, Yan R Z. Mathematical modeling and analysis of double-sided polishing process for 300 mm silicon wafers［J］. Microelectronics,2008,38(3):373-37.
[5] 金杨福,李伟,胡刚翔,等.双面抛光加工运动过程分析与数学模型的建立［J］.南京航空航天大学学报,2005,(37):86-89.
Jin Y F, Li W, Hu G X, et al. Motion analysis for double-sided polishing process and mathematical model establishing［J］. Journal of Nanjing University of Aeronautics &Astronautic,2005,(37):86-89.
[6] Toshi K. A kinematic analysis of disk motion in a double sided polisher for chemical mechanical planarization (CMP)［J］. Tribology Internationa, 2008,(41): 111-118.
[7] Barney E. Comparison of material removal rate models and experimental results for the double-sided polishing process［J］.Journal of Materials Processing Technology,2001,(109): 248-253.
[8] Wenski G, Altmann T, Winkler W, et al. Double-side polishing - a technology mandatory for 300 mm wafer manufacturing［J］.Materials Science in Semiconductor Processing, 2003,(5): 375-380.
[9] Hocheng H, Tsai H Y, Su Y T. Modeling and experimental analysis of the material removal rate in the chemical mechanical planarization of dielectric films and bare silicon wafers［J］.Journal of The Electrochemical Society, 2001, 148(10): G581-G586.
[10] Paul E, Kaufman F, Vacassy R.A model of copper CMP［J］. Journal of The Electrochemical Society ,2005,152(4): G322-G328.
[11] 胡刚翔,李伟.单晶硅双面抛光加工理论及工艺优化的研究［D］.浙江:浙江工业大学,2007.
Hu G X, Li W. Research on the double-sided polishing mechanism and process optmization for sillicon wafer［D］.ZheJiang: Zhe Jiang University of Technology,2007.
张彦, 李军, 朱永伟, 高平, 李标, 蒋毕亮, 左敦稳. 双面抛光运动的数学建模及轨迹优化[J]. 光学技术, 2011, 37(3): 279. ZHANG Yan, LI Jun, ZHU Yongwei, GAO Ping, LI Biao, JIANG Biliang, ZUO Dunwen. Mathematical modeling and trajectory optimization of double-sided polishing process[J]. Optical Technique, 2011, 37(3): 279.
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