透红外硫系玻璃微压印工艺的仿真研究
沈萍, 刘卫国. 透红外硫系玻璃微压印工艺的仿真研究[J]. 光学仪器, 2011, 33(2): 83.
SHEN Ping, LIU Weiguo. Simulation study on micro-molding process of infrared chalcogenide glass[J]. Optical Instruments, 2011, 33(2): 83.
[1] 张振远,凌根华.硫系玻璃红外光纤［J］.玻璃纤维,2005(1):14-18.
[2] 罗康,段智勇.纳米压印技术进展及应用［J］.电子工艺技术,2009,30(5):253-257.
[3] PAN W J,FURNISS D,ROWE H,et al.Fine embossing of chalcogenide glasses:first time submicron definition of surface embossed features［J］.Journal of Non-Crystalline Solids,2007,353:1302-1306.
[4] CURATU G,BINKLEY B,TINCH D,et al.Using molded chalcogenide glass technology to reduce cost in a compact wide-angle thermal imaging lens［DB/OL］.［2006-01-08］.http:∥www.lightpath.com/literature/technicalPapers/MoldedChalcogenideGlassTechnology.pdf.
[5] SEDDON A B,PAN W J,FURNISS D,et al.Fine embossing of chalcogenide glasses-a new fabrication route for photonic integrated circuits［J］.Journal of Non-Crystalline Solids,2006,352:2515-2520.
[6] ZHOU T F,YAN J W,MASUDA J,et al.Investigation on the viscoelasticity of optical glass in ultraprecision lens molding process［J］.Journal of Materials Processing Technology,2009,209:4484-4489.
[7] JAIN A.Experimental study and numerical analysis of compression molding process for manufacturing precision aspherical glass lenses［D］.Columbus:The Ohio University,2006.
[8] LIU C,LI J M,LIU J S,et al.Deformation behavior of solid polymer during hot embossing process［J］.Microelectronic Engineering,2010,87:200-207.
[9] LIU C,LI J M,LIANG Y,et al.Filling modes of polymer during submicron and nano-fabrication near glass transition temperature［J］.Journal of Materials Processing Technology,2010,210:696-702.
[10] CHANG Y C,WU T T,CHEN M F,et al.Finite element simulation of micro-impringting in Mg-Cu-Y amorphous alloy［J］.Materials Science and Engineering,2009,499:153-156.
沈萍, 刘卫国. 透红外硫系玻璃微压印工艺的仿真研究[J]. 光学仪器, 2011, 33(2): 83. SHEN Ping, LIU Weiguo. Simulation study on micro-molding process of infrared chalcogenide glass[J]. Optical Instruments, 2011, 33(2): 83.
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