光学技术, 2015, 41 (3): 261, 网络出版: 2015-05-20
特殊IC板引脚焊点缺陷检测中景深的研究
Research on the depth of field of soldering defect inspection for special integrated circuit units board
补充材料
许增朴, 王鑫, 王永强, 周聪玲. 特殊IC板引脚焊点缺陷检测中景深的研究[J]. 光学技术, 2015, 41(3): 261. XU Zengpu, WANG Xin, WANG Yongqiang, ZHOU Congling. Research on the depth of field of soldering defect inspection for special integrated circuit units board[J]. Optical Technique, 2015, 41(3): 261.