VITA MARK II牙科玻璃陶瓷超快激光铣削工艺

胡培鑫; 姚路; 吕启涛; 吉恩才; 聂子林; 何正娣

doi:doi:10.3788/LOP57.051402

激光与光电子学进展, 2020, 57 (5): 051402, 网络出版: 2020-03-05

VITA MARK II牙科玻璃陶瓷超快激光铣削工艺下载： 1271次

Ultra-Fast Laser Milling Technology for VITA MARK II Dental Glass Ceramics

胡培鑫 ^1,2姚路 ^1,2吕启涛 ^2,3吉恩才 ³聂子林 ²何正娣 ^2,*

作者单位

¹ 深圳大学应用技术学院, 广东深圳 518000

² 深圳技术大学中德智能制造学院数字化口腔激光智能制造重点实验室, 广东深圳 518118

³ 大族激光科技产业集团股份有限公司光源事业部, 广东深圳 518000

图 & 表

图 1. 激光系统结构示意图

Fig. 1. Schematic of experimental structure of laser system

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图 2. 当扫描速度为300 mm/s时,不同重复频率下VITA MARK II 牙科玻璃陶瓷的铣削效率

Fig. 2. Milling efficiency of VITA MARK II with different repetition frequencies at the scanning speed of 300 mm/s

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图 3. VITA MARK II 牙科玻璃陶瓷单脉冲铣削量随单脉冲能量密度的变化

Fig. 3. Pulse milling amount of VITA MARK II varying with the pulse energy intensity

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图 4. 重复频率为100 kHz、扫描速度为100 mm/s时铣削深度的实验结果。(a)加工表面形貌;(b) 3D模型;(c)深度测量结果

Fig. 4. Experimental results in the condition of repetition frequency of 100 kHz and scanning speed of 100 mm/s:(a) Machined surface topography; (b) 3D model; (c) depth measurement result

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图 5. 当脉冲重复频率为100 kHz时,VITA MARK II 牙科玻璃陶瓷的铣削效率的变化情况。(a)铣削效率随扫描速度的变化; (b)铣削效率随单位距离内脉冲能量的变化

Fig. 5. Change of milling efficiency of VITA MARK II at the pulse repetition frequency of 100 kHz. (a) Milling efficiency changed with the scanning speed; (b) milling efficiency changed with the pulse energy per unit distance

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图 6. 激光脉冲扫描加工示意图

Fig. 6. Schematic of laser pulse scanning processing

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图 7. 不同条件下超快激光铣削牙科玻璃陶瓷加工效果。(a)重复频率;(b)扫描速度

Fig. 7. Processing effect of VITA MARK II by ultrafast laser under different conditions. (a) Repetition frequency; (b) scanning speed

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图 8. 当扫描速度为300 mm/s时,不同重复频率下的加工效果形貌(放大30倍)。(a) 50 kHz;(b) 100 kHz; (c) 300 kHz;(d) 500 kHz

Fig. 8. Machined topography (×30) with different repetition frequencies in the condition of scanning speed of 300 mm/s. (a) 50 kHz; (b) 100 kHz; (c) 300 kHz; (d) 500 kHz

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图 9. 当重复频率为300 mm/s时,不同振镜扫描速度下的加工效果形貌(放大20倍)。(a) 50 mm/s;(b) 100 mm/s; (c) 150 mm/s;(d) 200 mm/s;(e) 300 mm/s;(f) 400 mm/s

Fig. 9. Machined topography (×20) with different scanning speeds in the condition of repetition frequency of 300 mm/s. (a) 50 mm/s; (b) 100 mm/s; (c) 150 mm/s; (d) 200 mm/s; (e) 300 mm/s; (f) 400 mm/s

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图 10. 重复频率为100 kHz、扫描速度为200 mm/s时的实验结果。(a)加工表面形貌;(b) 3D模型;(c)深度测量结果

Fig. 10. Experimental results in the condition of repetition frequency of 100 kHz and scanning speed of 200 mm/s. (a) Machined surface topography; (b) 3D model; (c) depth measurement result

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图 11. 在单位距离脉冲数为500 pulse/mm条件下脉冲能量密度与加工深度的变化关系

Fig. 11. Relationship between pulse energy density and processing depth in the condition of pulse number per unit distance is 500 pulse/mm

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表 1牙科玻璃陶瓷VITA MARK II 的主要物理性能

Table1. Key physical properties of dental VITA MARK II glass-ceramic block

Physical properties of VITA MARK II	Flexural strength /MPa		Vickers hardness /VHN	Fracture toughness /(MPa·m^1/2)
Physical properties of VITA MARK II	Before thermocycling	After thermocycling			Before thermocycling	After thermocycling	Before thermocycling	After thermocycling
Mean value±standard deviation	112.4±3.2		112.1±2.3		6.4±0.1	6.3±0.1	2.34±0.04	2.33±0.03

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表 2不同脉冲重复频率下5 W红外飞秒激光器的输出功率及单脉冲能量密度

Table2. Output power and pulse energy intensity of 5 W infrared femtosecond laser at different pulse repetition frequencies

Pulse repetition frequency /kHz	50	100	150	200	250	300	350	400	500	1000
Laser output power /W	1.79	3.99	4.23	5.33	5.37	5.38	5.40	5.42	5.42	5.51
Pulse energy intensity /(J·cm^-2)	2.85	3.18	2.82	2.67	2.15	1.79	1.54	1.08	0.87	0.44

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表 3在500 pulse/mm条件下激光输出脉冲单线扫描加工深度

Table3. Processing depth of laser pulse single line scanning in the condition of 500 pulse/mm

Pulse repetition frequency /kHz	Scanning speed /(mm·s^-1)	Machined depth /μm	Pulse energy intensity /(J·cm^-2)
50	100	43.47	2.85
100	200	62.18	3.18
150	300	39.91	2.82
200	400	36.83	2.67
250	500	27.44	2.15
300	600	19.54	1.79
350	700	16.49	1.54
400	800	9.98	1.08
500	1000		0.87
1000	2000		0.44

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胡培鑫, 姚路, 吕启涛, 吉恩才, 聂子林, 何正娣. VITA MARK II牙科玻璃陶瓷超快激光铣削工艺[J]. 激光与光电子学进展, 2020, 57(5): 051402. Peixin Hu, Lu Yao, Qitao Lü, Encai Ji, Zilin Nie, Zhengdi He. Ultra-Fast Laser Milling Technology for VITA MARK II Dental Glass Ceramics[J]. Laser & Optoelectronics Progress, 2020, 57(5): 051402.

VITA MARK II牙科玻璃陶瓷超快激光铣削工艺下载： 1271次

图 1. 激光系统结构示意图

Fig. 1. Schematic of experimental structure of laser system

图 2. 当扫描速度为300 mm/s时,不同重复频率下VITA MARK II 牙科玻璃陶瓷的铣削效率

Fig. 2. Milling efficiency of VITA MARK II with different repetition frequencies at the scanning speed of 300 mm/s

图 3. VITA MARK II 牙科玻璃陶瓷单脉冲铣削量随单脉冲能量密度的变化

Fig. 3. Pulse milling amount of VITA MARK II varying with the pulse energy intensity

图 4. 重复频率为100 kHz、扫描速度为100 mm/s时铣削深度的实验结果。(a)加工表面形貌;(b) 3D模型;(c)深度测量结果

Fig. 4. Experimental results in the condition of repetition frequency of 100 kHz and scanning speed of 100 mm/s:(a) Machined surface topography; (b) 3D model; (c) depth measurement result

图 5. 当脉冲重复频率为100 kHz时,VITA MARK II 牙科玻璃陶瓷的铣削效率的变化情况。(a)铣削效率随扫描速度的变化; (b)铣削效率随单位距离内脉冲能量的变化

Fig. 5. Change of milling efficiency of VITA MARK II at the pulse repetition frequency of 100 kHz. (a) Milling efficiency changed with the scanning speed; (b) milling efficiency changed with the pulse energy per unit distance

图 6. 激光脉冲扫描加工示意图

Fig. 6. Schematic of laser pulse scanning processing

图 7. 不同条件下超快激光铣削牙科玻璃陶瓷加工效果。(a)重复频率;(b)扫描速度

Fig. 7. Processing effect of VITA MARK II by ultrafast laser under different conditions. (a) Repetition frequency; (b) scanning speed

图 8. 当扫描速度为300 mm/s时,不同重复频率下的加工效果形貌(放大30倍)。(a) 50 kHz;(b) 100 kHz; (c) 300 kHz;(d) 500 kHz

Fig. 8. Machined topography (×30) with different repetition frequencies in the condition of scanning speed of 300 mm/s. (a) 50 kHz; (b) 100 kHz; (c) 300 kHz; (d) 500 kHz

图 9. 当重复频率为300 mm/s时,不同振镜扫描速度下的加工效果形貌(放大20倍)。(a) 50 mm/s;(b) 100 mm/s; (c) 150 mm/s;(d) 200 mm/s;(e) 300 mm/s;(f) 400 mm/s

Fig. 9. Machined topography (×20) with different scanning speeds in the condition of repetition frequency of 300 mm/s. (a) 50 mm/s; (b) 100 mm/s; (c) 150 mm/s; (d) 200 mm/s; (e) 300 mm/s; (f) 400 mm/s

图 10. 重复频率为100 kHz、扫描速度为200 mm/s时的实验结果。(a)加工表面形貌;(b) 3D模型;(c)深度测量结果

Fig. 10. Experimental results in the condition of repetition frequency of 100 kHz and scanning speed of 200 mm/s. (a) Machined surface topography; (b) 3D model; (c) depth measurement result

图 11. 在单位距离脉冲数为500 pulse/mm条件下脉冲能量密度与加工深度的变化关系

Fig. 11. Relationship between pulse energy density and processing depth in the condition of pulse number per unit distance is 500 pulse/mm

表 1牙科玻璃陶瓷VITA MARK II 的主要物理性能

Table1. Key physical properties of dental VITA MARK II glass-ceramic block

表 2不同脉冲重复频率下5 W红外飞秒激光器的输出功率及单脉冲能量密度

Table2. Output power and pulse energy intensity of 5 W infrared femtosecond laser at different pulse repetition frequencies

表 3在500 pulse/mm条件下激光输出脉冲单线扫描加工深度

Table3. Processing depth of laser pulse single line scanning in the condition of 500 pulse/mm

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图 1. 激光系统结构示意图

Fig. 1. Schematic of experimental structure of laser system

图 2. 当扫描速度为300 mm/s时,不同重复频率下VITA MARK II 牙科玻璃陶瓷的铣削效率

Fig. 2. Milling efficiency of VITA MARK II with different repetition frequencies at the scanning speed of 300 mm/s

图 3. VITA MARK II 牙科玻璃陶瓷单脉冲铣削量随单脉冲能量密度的变化

Fig. 3. Pulse milling amount of VITA MARK II varying with the pulse energy intensity

图 4. 重复频率为100 kHz、扫描速度为100 mm/s时铣削深度的实验结果。(a)加工表面形貌;(b) 3D模型;(c)深度测量结果

Fig. 4. Experimental results in the condition of repetition frequency of 100 kHz and scanning speed of 100 mm/s:(a) Machined surface topography; (b) 3D model; (c) depth measurement result

图 5. 当脉冲重复频率为100 kHz时,VITA MARK II 牙科玻璃陶瓷的铣削效率的变化情况。(a)铣削效率随扫描速度的变化; (b)铣削效率随单位距离内脉冲能量的变化

Fig. 5. Change of milling efficiency of VITA MARK II at the pulse repetition frequency of 100 kHz. (a) Milling efficiency changed with the scanning speed; (b) milling efficiency changed with the pulse energy per unit distance

图 6. 激光脉冲扫描加工示意图

Fig. 6. Schematic of laser pulse scanning processing

图 7. 不同条件下超快激光铣削牙科玻璃陶瓷加工效果。(a)重复频率;(b)扫描速度

Fig. 7. Processing effect of VITA MARK II by ultrafast laser under different conditions. (a) Repetition frequency; (b) scanning speed

图 8. 当扫描速度为300 mm/s时,不同重复频率下的加工效果形貌(放大30倍)。(a) 50 kHz;(b) 100 kHz; (c) 300 kHz;(d) 500 kHz

Fig. 8. Machined topography (×30) with different repetition frequencies in the condition of scanning speed of 300 mm/s. (a) 50 kHz; (b) 100 kHz; (c) 300 kHz; (d) 500 kHz

图 9. 当重复频率为300 mm/s时,不同振镜扫描速度下的加工效果形貌(放大20倍)。(a) 50 mm/s;(b) 100 mm/s; (c) 150 mm/s;(d) 200 mm/s;(e) 300 mm/s;(f) 400 mm/s

Fig. 9. Machined topography (×20) with different scanning speeds in the condition of repetition frequency of 300 mm/s. (a) 50 mm/s; (b) 100 mm/s; (c) 150 mm/s; (d) 200 mm/s; (e) 300 mm/s; (f) 400 mm/s

图 10. 重复频率为100 kHz、扫描速度为200 mm/s时的实验结果。(a)加工表面形貌;(b) 3D模型;(c)深度测量结果

Fig. 10. Experimental results in the condition of repetition frequency of 100 kHz and scanning speed of 200 mm/s. (a) Machined surface topography; (b) 3D model; (c) depth measurement result

图 11. 在单位距离脉冲数为500 pulse/mm条件下脉冲能量密度与加工深度的变化关系

Fig. 11. Relationship between pulse energy density and processing depth in the condition of pulse number per unit distance is 500 pulse/mm

表 1牙科玻璃陶瓷VITA MARK II 的主要物理性能

Table1. Key physical properties of dental VITA MARK II glass-ceramic block

表 2不同脉冲重复频率下5 W红外飞秒激光器的输出功率及单脉冲能量密度

Table2. Output power and pulse energy intensity of 5 W infrared femtosecond laser at different pulse repetition frequencies

表 3在500 pulse/mm条件下激光输出脉冲单线扫描加工深度

Table3. Processing depth of laser pulse single line scanning in the condition of 500 pulse/mm

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