光学学报, 2010, 30 (6): 1662, 网络出版: 2010-06-07   

光学引伸计在低维材料实时应变测量中的应用

Application of Optical Extensometer on the Real-Strain Measurement of Low-Dimensional Materials
王伟 1,2,*何小元 2
作者单位
1 南京工程学院 建筑工程学院,江苏 南京 211167
2 东南大学 工程力学系,江苏 南京 210096
摘要
随着低维材料的广泛应用,有关低维材料力学性能的研究成为当前热点之一。在低维材料实时应变测量中,大标距试件表面上的跟踪目标移出图像跟踪范围,会导致跟踪目标的丢失,影响材料的实时应变测量。利用基于数字图像跟踪技术的光学引伸计将大标距转换成小标距,不仅可以在应变测量时保持跟踪目标在视场范围内移动,实现实时跟踪,而且可以动态了解低维材料应变变化规律。利用微力学万能试验机和光学引伸计同时进行低维材料的应变测量,实验结果表明,二者规律基本吻合且后者利用双线性插值可以将目标定位在0.01 pixel上,说明光学引伸计完全可以应用于低维材料的实时应变测量中,并为探讨低维材料动态力学性能提供了一种新的实验方法。
Abstract
The study of mechanical property about low-dimensional materials with its wide application has been one of the hot-spots. In the real-strain measurement of low-dimensional materials,the tracking target on the surface of large distance specimen would move out the scope of image tracking. In this way,the tracking target might be lost,which affects the real-strain measurement. So the optical extensometer based on digital image tracking technology is proposed to change the large distance to small one. Then,the tracking objective is adjusted to move in the screen field of view. The method of real tracking can be realized. Moreover,the strain regulation of low-dimensional materials might be dynamically learned. The strain measurement is carried out using micro-mechanics universal testing machine and optical extensometer together. From the experiment,the results obtained by the optical extensometer are agreed with ones obtained by the micro-mechanics universal testing machine. And,the objective is orientated in the 0.01 pixel location using the arithmetic of bilinear inter value. So,the optical extensometer can be applied on the real-strain measurement of low-dimensional materials. Also,a new experimental method is offered for studying the dynamic mechanics of low-dimensional materials.
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王伟, 何小元. 光学引伸计在低维材料实时应变测量中的应用[J]. 光学学报, 2010, 30(6): 1662. Wang Wei, He Xiaoyuan. Application of Optical Extensometer on the Real-Strain Measurement of Low-Dimensional Materials[J]. Acta Optica Sinica, 2010, 30(6): 1662.

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