激光与光电子学进展, 2012, 49 (2): 022202, 网络出版: 2011-10-21
碳化硅光学表面抛光机理研究
Study on the Polishing Mechanism of Silicon Carbide Optical Surface
光学制造 抛光机理 碳化硅 压痕断裂模型 optical manufacturing polishing mechanism silicon carbide indentation fracture model
摘要
碳化硅光学反射镜已经在国民生活各个领域得到广泛应用,但是其抛光机理尚不明确。对碳化硅光学表面抛光机理进行了研究。介绍了陶瓷材料的磨削机理压痕断裂模型。应用压痕断裂模型分析了理想状态下的碳化硅抛光过程,并研究了实际抛光过程中碳化硅光学表面的抛光机理。
Abstract
The polishing mechanism of silicon carbide optical surface still remains untouched. This paper studies the polishing mechanism of silicon carbide optical surface; it also introduces the grinding mechanism of ceramic materialindentation fracture model. The model of silicon carbide polishing in ideal condition is analyzed and the mechanism of silicon carbide polishing in real state is studied.
范镝. 碳化硅光学表面抛光机理研究[J]. 激光与光电子学进展, 2012, 49(2): 022202. Fan Di. Study on the Polishing Mechanism of Silicon Carbide Optical Surface[J]. Laser & Optoelectronics Progress, 2012, 49(2): 022202.