半导体光电, 2019, 40 (3): 375, 网络出版: 2019-07-09
FBG封装材料热膨胀系数对温度传感精度的影响
The Influence of Thermal Expansion Coefficient of FBG Packaging Material on Temperature Sensing Accuracy
引用该论文
韩笑笑, 员琳, 樊琳琳, 张峰, 辛明, 杨濠琨, 张锦龙. FBG封装材料热膨胀系数对温度传感精度的影响[J]. 半导体光电, 2019, 40(3): 375.
HAN Xiaoxiao, YUAN Lin, FAN Linlin, ZHANG Feng, XIN Ming, YANG Haokun, ZHANG Jinlong. The Influence of Thermal Expansion Coefficient of FBG Packaging Material on Temperature Sensing Accuracy[J]. Semiconductor Optoelectronics, 2019, 40(3): 375.
韩笑笑, 员琳, 樊琳琳, 张峰, 辛明, 杨濠琨, 张锦龙. FBG封装材料热膨胀系数对温度传感精度的影响[J]. 半导体光电, 2019, 40(3): 375. HAN Xiaoxiao, YUAN Lin, FAN Linlin, ZHANG Feng, XIN Ming, YANG Haokun, ZHANG Jinlong. The Influence of Thermal Expansion Coefficient of FBG Packaging Material on Temperature Sensing Accuracy[J]. Semiconductor Optoelectronics, 2019, 40(3): 375.