红外技术, 2012, 34 (8): 444, 网络出版: 2012-08-31
HgCdTe焦平面红外探测器封装中的芯片粘接技术
Die Attach Technology in HgCdTe IRFPA Detector Package
摘要
针对HgCdTe焦平面红外探测器封装的特殊性, 提出了芯片粘接胶的选用原则, 影响粘接质量的主要因素, 以及粘接工艺优化方法。提出了用于封装HgCdTe MW 320×256探测器的低温胶X1, 并对该胶做了一系列可靠性实验。实验证明, 低温胶X1满足该探测器的封装要求。
Abstract
Concerning the special properties of the HgCdTe FPAIR detector package, the basic principles of adhesive selection, the main factors affecting the bonding quality, and the optimization of the die attach methods are introduced. Low-temperature adhesive X1 is proposed to package HgCdTe MW 320×256 detectors, and the reliability experiments show that adhesive X1 meets the package requirements.
熊雄, 朱颖峰, 王微, 黄一彬, 刘远勇. HgCdTe焦平面红外探测器封装中的芯片粘接技术[J]. 红外技术, 2012, 34(8): 444. XIONG Xiong, ZHU Ying-feng, WANG Wei, HUANG Yi-bin, LIU Yuan-yong. Die Attach Technology in HgCdTe IRFPA Detector Package[J]. Infrared Technology, 2012, 34(8): 444.
PDF全文
