Frontiers of Optoelectronics, 2010, 3 (2): 139, 网络出版: 2012-09-20
Nano materials for microelectronic and photonic packaging
Nano materials for microelectronic and photonic packaging
摘要
Abstract
This paper addresses the state-of-the-art nanoscience and technology regarding next generation high density microelectronics and photonics packaging applications, including carbon nanotubes (CNTs) for electrical/thermal devices, and molecular wires for electrical interconnects, etc.
Ching-Ping WONG, Wei LIN, Ling-Bo ZHU, Hong-Jin JIANG, Rong-Wei ZHANG, Yi LI, Kyoung-Sik MOON. Nano materials for microelectronic and photonic packaging[J]. Frontiers of Optoelectronics, 2010, 3(2): 139. Ching-Ping WONG, Wei LIN, Ling-Bo ZHU, Hong-Jin JIANG, Rong-Wei ZHANG, Yi LI, Kyoung-Sik MOON. Nano materials for microelectronic and photonic packaging[J]. Frontiers of Optoelectronics, 2010, 3(2): 139.
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