[1] Zhu L B, Sun Y Y, Hess D W, Wong C P. Well-aligned open-ended carbon nanotube architectures: an approach for device assembly. Nano Letters, 2006, 6(2): 243-247

[2] Zhu L B, Xiu Y H, Hess D W, Wong C P. Aligned carbon nanotube stacks by water-assisted selective etching. Nano Letters, 2005, 5(12): 2641-2645

[3] Jiang H J, Zhu L B, Moon K S,Wong C P. The preparation of stable metal nanoparticles on carbon nanotubes whose surfaces were modified during production. Carbon, 2007, 45(3): 655-661

[4] Jiang H J, Zhu L B, Moon K S. Low temperature carbon nanotube film transfer via conductive polymer composites. Nanotechnology, 2007, 18(12): 125203

[5] Lin W, Xiu Y H, Jiang H J, Zhang R W, Hildreth O, Moon K S, Wong C P. Self-assembled monolayer-assisted chemical transfer of in situ functionalized carbon nanotubes. Journal of the American Chemical Society, 2008, 130(30): 9636-9637

[6] Lin W, Moon K S, Wong C P. A combined process of in situ functionalization and microwave treatment to achieve ultrasmall thermal expansion of aligned carbon nanotube-polymer nanocomposites: toward applications as thermal interface materials. Advanced Materials, 2009, 21(23): 2421-2424

[7] Lin W, Zhang R W, Moon K S, Wong C P. Molecular phonon couplers at carbon nanotube/substrate interface to enhance interfacial thermal transport. Carbon, 2010, 48(1): 107-113

[8] Lin W, Olivares R V, Liang Q Z, Zhang RW, Moon K S,Wong C P. Vertically aligned carbon nanotubes on copper substrates for applications as thermal interface materials: from synthesis to assembly. In: Proceedings of Electronic Components and Technology Conference. San Diego, 2009, 441-447

[9] Artaki I, Jackson A M, Vianco P T. Evaluation of lead-free solder joints in electronic assemblies. Journal of Electronic Materials, 1994, 23(8): 757-764

[10] Lai S L, Guo J Y, Petrova V, Ramanath G, Allen L H. Size-dependent melting properties of small tin particles: nanocalorimetric measurements. Physical Review Letters, 1996, 77(1): 99-102

[11] Bachels T, Guntherodt H J, Schafer R. Melting of isolated tin nanoparticles. Physical Review Letters, 2000, 85(6): 1250-1253

[12] Zhao S J, Wang S Q, Cheng D Y, Ye H Q. Three distinctive melting mechanisms in isolated nanoparticles. Journal of Physical Chemistry B, 2001, 105(51): 12857-12860

[13] Hu W Y, Xiao S F, Yang J Y, Zhang Z. Melting evolution and diffusion behavior of vanadium nanoparticles. The European Physical Journal B, 2005, 45(4): 547-554

[14] Li Y, Moon K S, Wong C P. Electronics without lead. Science, 2005, 308(5727): 1419-1420

[15] Li Y,Wong C P. Recent advances of conductive adhesives as a leadfree alternative in electronic packaging: materials, processing, reliability and applications. Materials Science and Engineering, R: Reports, 2006, R51(1-3): 1-35

[16] Li Y, Moon K S, Wong C P. Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives. Journal of Electronic Materials, 2005, 34(3): 266-271

[17] Zhang R W, Li Y, Yim M J, Moon K S, Lu D D, Wong C P. Enhanced electrical properties of anisotropic conductive adhesive with pi-conjugated self-assembled molecular wire junctions. IEEE Transactions on Components and Packaging Technology, 2009, 32(3): 677-683

[18] Li Y, Yim M J, Wong C P. High performance nonconductive film with π-conjugated self-assembled molecular wires for fine pitch interconnect applications. Journal of Electronic Materials, 2007, 36(5): 549-554