实现了一种采用聚苯乙烯纳米球自组装技术和微机械制造技术加工的场发射阴极用亚微米栅极微孔阵列。设计了一套完整的工艺实验方案，首先采用微球自组装技术获得了亚微米级金属网孔掩膜，然后通过反应离子刻蚀技术获得了亚微米栅极孔阵列，从而实现了集成度高、分布均匀的周期性亚微米孔洞阵列的制备，微孔集成度达到108cm-2。实验研究了氧气刻蚀聚苯乙烯微球的规律。采用金属掩膜，四氟化碳干法刻蚀二氧化硅，获得了深度为500 nm的微孔。实验结果证明该工艺方案是一种获得大面积、均匀分布、集成度高的场发射冷阴极栅孔阵列的有效方法。

A novel fabrication technique for high density gate hole arrays used in field emission cold cathodes is present here. This technique has been implemented by combining the micro electromechanical system (MEMS) processes with the microsphere lithography. Microsphere photolithography (MSP) generates a large area of highly uniform periodic sub-micrometer spot arrays by utilizing the monolayer of polystyrene (PS) latex microspheres as mask on top of silicon or silica. A large area of highly uniform sub-micrometer grid hole arrays (300-600 nm) with the array period of 0.75 μm can be fabricated by the combination of lift-off and MSP. Microhole array density reaches to 108 holes/cm2. This is a promising method to fabricate a large area of highly uniform periodic and high-density gate hole arrays for field emission cold cathodes. The period is restricted by the microsphere diameter. The gate aperture can be tuned by shrinking the PS sphere using O2 reaction ion etching (RIE).