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荧光粉封装方式对多芯片阵列LED封装效率的影响

Effect of Different Packaging of Phosphor on the Encapsulation Efficiency of Multi-chips LED

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摘要

针对荧光粉封装的多芯片LED,用Monte Carlo光线追迹的方法仿真光线在蓝光芯片和荧光粉中的传播, 并分析了荧光粉封装方式对多芯片阵列LED封装效率的影响.结果表明:随着荧光粉层和芯片之间的距离增大, 保型涂覆的LED封装效率先增加后减小, 最大封装效率为59%; 平面涂覆的LED在芯片间距为0.2 mm、荧光粉层和芯片之间的距离为0.28 mm时,封装效率为77.183%; 荧光粉层的曲率半径对封装效率的影响较小.

Abstract

For the multi-chips LED packaged by phosphor layers, the light propagation in blue chip and phosphor layer was simulated based on the mathod of Monte Carlo. The influence of the encapsulation efficiency on different distrances between chip and phosphor layer was analyzed. The result shows that, the encapsulation efficiency of conformal coating firstly rises, then drops with the increasing of the diameter. The flat remote coating has a higher efficiency compared with others. The maximum encapsulation efficiency reaches up to 77.183% for the flat remote coating while the gap of chips is set as 0.2 mm and the distance between chip and phosphor layer is 0.28 mm. The influence of the curvature radius of phosphor layer on encapsulation efficiency is small.

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中图分类号:TN312.8

DOI:10.3788/gzxb20164507.0723003

基金项目:顺德区产学研合作项目(No.2014 CXY08)和浙江省仪器科学与技术重中之重建设学科光电检测方向人才培育计划项目(No.JL150541)资助

收稿日期:2015-12-18

修改稿日期:2016-04-08

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作者单位    点击查看

曹艳亭:中国计量学院 光学与电子科技学院, 杭州 310018
陈超:中国计量学院 光学与电子科技学院, 杭州 310018
梁培:中国计量学院 光学与电子科技学院, 杭州 310018
黄杰:中国计量学院 光学与电子科技学院, 杭州 310018

联系人作者:曹艳亭(cyt@cjlu.edu.cn)

备注:曹艳亭(1991-), 女, 硕士研究生, 主要研究方向为LED封装与光学设计.

【1】SCHUBERT E F. Light-emitting diodes[M]. Cambridge UK: Cambridge University Press, 2006.

【2】HARTMANN P, WENZL F P, SOMMER C, et al. White LEDs and modules in chip-on-board technology for general lighting[C]. SPIE, 2006: 63370I.

【3】AN Tao, LI Peng,DU Mu-han, et al. Performance of fluorescent white organic light-emitting device by introolucing ultrathin emitting layer[J]. Chinese Journal of Luminescence, 2015, 36(6): 645-650.
安涛, 李鹏, 杜牧涵, 等.超薄发光层结构的荧光型白光有机发光器件[J].发光学报, 2015, 36(6):645-650.

【4】LIU Hao. Research on reliability of high power LED package[D]. Wuhan, Huazhong University of Science and Technology, 2007.
刘浩. 高功率LED封装的可靠性研究[D]. 武汉: 华中科技大学, 2007.

【5】WANG Chun-qing, HANG Cun-jin, ZHANG Wei. The structure and manufacturing technology of high power multi chip LED package[C]. China International Semiconductor Lighting Forum, 2011.
王春青, 杭春进, 张威. 大功率多芯片LED封装的结构及制造关键技术研究[C]. 中国国际半导体照明论坛, 2011.

【6】LIU Yi-bing, DING Jie. Summarization on packaging technique of power-LED[J]. Chinese Journal of Liquid Crystals, 2008, 23(4): 508-513.
刘一兵, 丁洁.功率型LED封装技术[J]. 液晶与显示, 2008, 23(4): 508-513.

【7】FUJII T, GAO Y, SHARMA R, et al. Increase in the extraction efficiency of GaN-based light-emitting diodes via surface roughening[J]. Applied Physics Letters, 2004, 84(6): 855-857.

【8】KISSINGER S, JEONG S M, YUN S H, et al. Enhancement in emission angle of the blue LED chip fabricated on lens patterned sapphire[J]. Solid-State Electronics, 2010, 54(5): 509515.

【9】CHO H K, JANG J, CHOI J H, et al. Light extraction enhancement from nano-imprinted photonic crystal GaN-based blue light-emitting diodes[J]. Optics Express, 2006, 14(19): 8654-8660.

【10】SHUAI Yun, HE Yong-zhi, TRAN N T, et al. Angular CCT uniformity of phosphor converted white LEDs: Effects of phosphor materials and packaging structures[J]. Technology Letters IEEE, 2011, 23(3):137-139.

【11】MA Ming, MONT FW, YAN X, et al. Effects of the refractive index of the encapsulant on the light-extraction efficiency of light-emitting diodes[J]. Optics Express, 2011, 5(19): A1135-A1140.

【12】LUO Hong, KIM K S, XI Y A, et al. Trapped whispering-gallery optical modes in white light-emitting diode lamps with remote phosphor[J]. Applied Physics Letters, 2006, 89(4): 041125.

【13】ROBERT C, CASELLA G. Monte Carto statistical methods[M]. World Publishing Corp, 2009.

【14】LIN J H, MA S H. Analyzing of light pattern uniformity in multi-chips LED lighting[M]. 2014.

【15】YU Ren-yong, JIN Shang-zhong, LIANG Pei, et al. Monte Carlo simulation on LEDs graded-refractive-index-encapsulation[J]. Acta Photonica Sinica, 2010, 39(12): 2200-2223.
余仁勇, 金尚忠, 梁培, 等. LED梯度折射率封装结构的蒙特卡罗模拟[J]. 光子学报, 2010, 39(12): 2200-2223.

【16】YU R Y, JIN S, CEN S, et al. Effect of the phosphor geometry on the luminous flux of phosphor-converted light-emitting diodes[J]. Photonics Technology Letters, IEEE, 2010, 22(23): 1765-1767.

【17】LIU Zong-yun. Research on design and manufacture of high power LED package[D]. Wuhan, Huazhong University of Science and Technology, 2010.
刘宗源. 大功率 LED 封装设计与制造的关键问题研究[D]. 武汉: 华中科技大学, 2010.

【18】ZHOU Qing-chao, BAI Ze-long, LU Lu, et al. Remote phosphor technology for white LED applications: advances and prospects[J]. Chinese Optics, 2015, 8(3): 313-328.
周青超, 柏泽, 鲁路, 等. 白光LED远程荧光粉技术研究进展与展望[J]. 中国光学, 2015, 8(3): 313-328.

【19】HU Fei, QIAN Ke-yuan, LUO Yi. Far-field pattern simulation of flip-chip bonded power light-emitting diodes by a Monte Carlo photon-tracing method[J]. Applied Optics, 2005, 44(14): 2768-2771.

【20】LIU Z, LIU S, WANG K, et al. Effects of phosphor′s location on LED packaging performance[C]. International Conference on Electronic Packaging Technology & High Density Packaging, 2008: 1-7.

引用该论文

CAO Yan-ting,CHEN Chao,LIANG Pei,HUANG Jie. Effect of Different Packaging of Phosphor on the Encapsulation Efficiency of Multi-chips LED[J]. ACTA PHOTONICA SINICA, 2016, 45(7): 070723003

曹艳亭,陈超,梁培,黄杰. 荧光粉封装方式对多芯片阵列LED封装效率的影响[J]. 光子学报, 2016, 45(7): 070723003

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