荧光粉封装方式对多芯片阵列LED封装效率的影响
[1] SCHUBERT E F. Light-emitting diodes[M]. Cambridge UK: Cambridge University Press, 2006.
[2] HARTMANN P, WENZL F P, SOMMER C, et al. White LEDs and modules in chip-on-board technology for general lighting[C]. SPIE, 2006: 63370I.
[3] 安涛, 李鹏, 杜牧涵, 等.超薄发光层结构的荧光型白光有机发光器件[J].发光学报, 2015, 36(6):645-650.
[4] 刘浩. 高功率LED封装的可靠性研究[D]. 武汉: 华中科技大学, 2007.
LIU Hao. Research on reliability of high power LED package[D]. Wuhan, Huazhong University of Science and Technology, 2007.
[5] 王春青, 杭春进, 张威. 大功率多芯片LED封装的结构及制造关键技术研究[C]. 中国国际半导体照明论坛, 2011.
WANG Chun-qing, HANG Cun-jin, ZHANG Wei. The structure and manufacturing technology of high power multi chip LED package[C]. China International Semiconductor Lighting Forum, 2011.
[6] 刘一兵, 丁洁.功率型LED封装技术[J]. 液晶与显示, 2008, 23(4): 508-513.
LIU Yi-bing, DING Jie. Summarization on packaging technique of power-LED[J]. Chinese Journal of Liquid Crystals, 2008, 23(4): 508-513.
[7] FUJII T, GAO Y, SHARMA R, et al. Increase in the extraction efficiency of GaN-based light-emitting diodes via surface roughening[J]. Applied Physics Letters, 2004, 84(6): 855-857.
[8] KISSINGER S, JEONG S M, YUN S H, et al. Enhancement in emission angle of the blue LED chip fabricated on lens patterned sapphire[J]. Solid-State Electronics, 2010, 54(5): 509515.
[9] CHO H K, JANG J, CHOI J H, et al. Light extraction enhancement from nano-imprinted photonic crystal GaN-based blue light-emitting diodes[J]. Optics Express, 2006, 14(19): 8654-8660.
[10] SHUAI Yun, HE Yong-zhi, TRAN N T, et al. Angular CCT uniformity of phosphor converted white LEDs: Effects of phosphor materials and packaging structures[J]. Technology Letters IEEE, 2011, 23(3):137-139.
[11] MA Ming, MONT FW, YAN X, et al. Effects of the refractive index of the encapsulant on the light-extraction efficiency of light-emitting diodes[J]. Optics Express, 2011, 5(19): A1135-A1140.
[12] LUO Hong, KIM K S, XI Y A, et al. Trapped whispering-gallery optical modes in white light-emitting diode lamps with remote phosphor[J]. Applied Physics Letters, 2006, 89(4): 041125.
[13] ROBERT C, CASELLA G. Monte Carto statistical methods[M]. World Publishing Corp, 2009.
[14] LIN J H, MA S H. Analyzing of light pattern uniformity in multi-chips LED lighting[M]. 2014.
[15] 余仁勇, 金尚忠, 梁培, 等. LED梯度折射率封装结构的蒙特卡罗模拟[J]. 光子学报, 2010, 39(12): 2200-2223.
[16] YU R Y, JIN S, CEN S, et al. Effect of the phosphor geometry on the luminous flux of phosphor-converted light-emitting diodes[J]. Photonics Technology Letters, IEEE, 2010, 22(23): 1765-1767.
[17] 刘宗源. 大功率 LED 封装设计与制造的关键问题研究[D]. 武汉: 华中科技大学, 2010.
LIU Zong-yun. Research on design and manufacture of high power LED package[D]. Wuhan, Huazhong University of Science and Technology, 2010.
[18] 周青超, 柏泽, 鲁路, 等. 白光LED远程荧光粉技术研究进展与展望[J]. 中国光学, 2015, 8(3): 313-328.
[19] HU Fei, QIAN Ke-yuan, LUO Yi. Far-field pattern simulation of flip-chip bonded power light-emitting diodes by a Monte Carlo photon-tracing method[J]. Applied Optics, 2005, 44(14): 2768-2771.
[20] LIU Z, LIU S, WANG K, et al. Effects of phosphor′s location on LED packaging performance[C]. International Conference on Electronic Packaging Technology & High Density Packaging, 2008: 1-7.
曹艳亭, 陈超, 梁培, 黄杰. 荧光粉封装方式对多芯片阵列LED封装效率的影响[J]. 光子学报, 2016, 45(7): 070723003. CAO Yan-ting, CHEN Chao, LIANG Pei, HUANG Jie. Effect of Different Packaging of Phosphor on the Encapsulation Efficiency of Multi-chips LED[J]. ACTA PHOTONICA SINICA, 2016, 45(7): 070723003.