激光与光电子学进展, 2011, 48 (9): 092302, 网络出版: 2011-07-25  

OLED封装技术进展 下载: 656次

Progress of Encapsulation Technology for OLED
作者单位
电子科技大学光电信息学院, 四川 成都 610054
摘要
有机电致发光器件(OLED)因具有较多的优点,在显示领域有着光明的前景,其最大的优越性在于能够实现柔性显示,制作成柔性有机电致发光二极管(FOLED)。OLED对水蒸气和氧气非常敏感,渗透进入器件内部的水蒸气和氧气是影响OLED寿命的主要因素,因此,封装技术对器件非常重要。对现有的主要的FOLED衬底材料和封装方法进行了总结,分析各种衬底材料和封装方法的优缺点。阐述了最新研究工作中柔性衬底的选择和新型封装方法的进展。
Abstract
Organic light emitting diode (OLED) device will have a bright future in the display field, because of its advantages. The most important advantage is the ability to achieve flexible display and be made into flexible organic light emitting diode (FOLED). OLED materials are extremely sensitive to vapor and oxygen. The vapor and oxygen penetrating into the interior of the device are the main factor that affects the lifetime of OLED. Thus, encapsulation technology is important to OLED device. The substrate material and encapsulation technology used in FOLED are reviewed and meanwhile, their advantages and disadvantages are fully discussed, and the progress of the recent research on novel substrate material and encapsulation method are described.
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梁宁, 李军建. OLED封装技术进展[J]. 激光与光电子学进展, 2011, 48(9): 092302. Liang Ning, Li Junjian. Progress of Encapsulation Technology for OLED[J]. Laser & Optoelectronics Progress, 2011, 48(9): 092302.

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