Vertical-cavity surface-emitting lasers for data communication and sensing

Anjin Liu; Philip Wolf; James A. Lott; Dieter Bimberg

doi:doi:10.1364/PRJ.7.000121

Photonics Research, 2019, 7 (2): 02000121, Published Online: Feb. 19, 2019

Vertical-cavity surface-emitting lasers for data communication and sensing Download： 956次

Anjin Liu ^1,2,3,*Philip Wolf ⁴James A. Lott ⁴Dieter Bimberg ^4,5

Author Affiliations

¹ Laboratory of Solid-State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

² State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

³ Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China

⁴ Institute of Solid State Physics and Center of Nanophotonics, Technische Universität Berlin, Hardenbergstrasse 36, 10623 Berlin, Germany

⁵ Bimberg Chinese-German Center for Green Photonics of the Chinese Academy of Sciences at CIOMP, Changchun 130033, China

Figures & Tables

Fig. 1. Schematic of a top-emitting VCSEL [19]. Inset is a scanning electron microscope image of the cross section of a high-speed VCSEL after it is cleaved.

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Fig. 2. Small-signal model of a VCSEL with the high-frequency driving source.

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Fig. 3. Schematic of representative optical modes (straight lines) and gain spectra (curves) behavior in a VCSEL as functions of increasing temperature. T0 denotes the typical room temperature.

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Fig. 4. Simulated PAM4 and on–off keying (OOK) eye diagrams at 40 Gbps with a constant modulation bandwidth of 20 GHz.

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Fig. 5. (a) End-to-end coupling between a VCSEL and a PIC based on an SOI platform [115]. A spot-size convertor in the PIC side is always adopted for a high coupling efficiency between the VCSEL and the silicon waveguide. (b) VCSEL coupled to a PIC by 45° micro-reflectors [116]. (c) Grating coupler for coupling between a VCSEL and a PIC [123]. (d) Photonic wire bond for integration for a surface-emitting laser and a PIC [127]. The laser can be a VCSEL or a distributed-feedback surface-emitting laser. PWB, photonic wire bond.

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Fig. 6. Schematic of a tracking system based on SMI [129,130].

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Fig. 7. Components of a face recognition module in a modern smartphone. (a) VCSELs for time-of-flight (ToF) proximity sensing and IR illumination. (b) VCSEL array for projection of randomly distributed dots to sense object distance information.

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Fig. 8. (a) Schematic of focal plane scanning [148,151]. (b) Illustration of structured light [153].

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Fig. 9. (a) Schematic of an HCG. The red arrows show the direction of wave incidence. The black arrows indicate the E-field direction in both TE and TM polarizations of incidence. (b) Double-mode solution exhibiting perfect intensity cancellation at the HCG output plane leading to 100% reflectivity [159].

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Fig. 10. (a) Schematic of an HCG-VCSEL [160]. (b) HCG-VCSEL array for single-lobe, double-lobe, triple-lobe, “bow-tie,” “sugar cone,” and “doughnut” beam patterns [177]. (c) Schematic of a nanoelectromechanical tunable VCSEL using the highly reflective HCG as its top mirror, instead of conventional DBRs [180]. (d) Schematic of a monolithic HCG-VCSEL array with different HCG parameters.

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Fig. 11. (a) Schematic of a VCSEL with a silicon HCG as a bottom mirror. An HCG serves as the bottom mirror and potentially serves as a waveguide coupler for an in-plane SOI waveguide, facilitating the integration of a VCSEL with in-plane silicon photonic circuits [188]. (b) Schematic of a vertical-cavity laser with lateral emission into a silicon waveguide via an HCG [189]. (c) Schematic of a vertical-cavity laser with in-plane out-coupling into a SiN waveguide. A subwavelength grating is inserted under a half-VCSEL to redirect the vertical resonance light to the in-plane SiN waveguide [192].

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Table1. Modulation Bandwidths and Bit Rates of VCSELs at Room Temperature Using the Standard On–Off Keying in a Back-to-Back Data Transmission Configuration

Group	$λ$ (nm)	Bandwidth (GHz)	Bit Rate (Gbps)	Temperature (°C)	Oxide Aperture (μm)	Year	Refs.
IBM	850	15.4	20	25	8	2001	[54]
Finisar-IBM	850	19	30	25	6	2008	[55]
CUT	850	20	32	25	9	2009	[56]
CUT	850	23	40	25	7	2010	[57]
CUT	850	28	44	25	7	2012	[58]
CUT	850	24	57	25	8	2013	[59]
CUT	850	30	50	25	3.5	2015	[60]
TU Berlin	850	20	30	25	6	2009	[61]
TU Berlin	850		40	25	9	2009	[62]
UIUC	850	21.2	40	20	4	2014	[63]
UIUC	850	29.2	57	25	5	2016	[64]
NCU	850	22.4	40	25	4	2013	[65]
NCU	850	26	41	25	8	2015	[66]
UCSB	980	>20	35	20	3	2007	[67]
TU Berlin	980		44	25	6	2011	[40]
TU Berlin	980	24.7	50	25	5	2014	[68]
TU Berlin	980	26.6	52	25	6	2016	[39]
TU Berlin	980	35.5		25	3	2018	[69]
CUT	1060	22	50	25	4	2017	[70]
NEC	1100	20	25	25	6.9	2006	[53]
NEC	1100	24	30	25	6	2007	[71]
NEC	1100	24	40	25	6	2008	[72]

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Table2. Selected Results on Bandwidths and Bit Rates of VCSELs at High Temperatures in an On–Off Keying Modulation Format for Back-to-Back Data Transmission Configuration

Group	$λ$ (nm)	Bandwidth (GHz)	Bit Rate (Gbps)	Temperature (°C)	Oxide Aperture (μm)	Year	Refs.
Finisar	850	10	14	95	8	2012	[91]
Emcore	850	16	28	85	7.5	2013	[92]
CUT	850	21	40	85	7	2013	[93]
IBM-CUT^a	850	21	50	90	6	2015	[94]
UIUC	850	24.5	50	85	5	2016	[64]
NCU	850	22.4	34	85	4	2013	[65]
NCU	850	20	41	85	8	2015	[66]
VIS	850		25	150	4	2018	[95]
VIS	850		25	130	4	2018	[95]
TU Berlin	980	11	20	120	3	2008	[97]
TU Berlin	980		38	85	6	2011	[40]
TU Berlin	980		30	120	6	2011	[40]
TU Berlin	980	23	46	85	5	2014	[68]
TU Berlin	980		38	85	5.5	2014	[98]
TU Berlin	980	18	35	85	3	2014	[99]
TU Berlin	980	24.5	50	85	6	2016	[39]
CUT	1060	16	40	85	4	2017	[70]

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Table3. Energy Efficiencies of High-Speed VCSELs with the On–Off Keying Modulation Format in a Back-to-Back Data Transmission Configuration

Group	$λ$ (nm)	Bit Rate (Gbps)	Temperature (°C)	Energy eff. (fJ/bit)	Oxide Aperture (μm)	Year	Refs.
TU Berlin-VIS	850	25	25	99	2	2011	[96]
TU Berlin-VIS	850	17	25	69	2	2011	[96]
TU Berlin-VIS	850	25	25	56	3.5	2012	[101]
TU Berlin	850	40	25	108	4	2013	[104]
CUT	850	50	25	95	3.5	2015	[60]
CUT	850	40	25	73	3.5	2015	[60]
UIUC	850	40	20	395	4	2014	[63]
NCU	850	12.5	25	109	6	2011	[105]
NCU	850	34	25	345	6	2011	[105]
NCU	850	34	25	107	4	2013	[65]
UCSB	980	35	20	286	3	2009	[67]
TU Berlin	980	38	85	177	5.5	2014	[98]
TU Berlin	980	35	85	139	3	2014	[99]
TU Berlin	980	35	25	145	3	2015	[106]
Furukawa	1060	10	25	140		2011	[107]
Furukawa	1060	25	25	76		2014	[108]
CUT	1060	50	25	100	4	2017	[70]

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Anjin Liu, Philip Wolf, James A. Lott, Dieter Bimberg. Vertical-cavity surface-emitting lasers for data communication and sensing[J]. Photonics Research, 2019, 7(2): 02000121.

Vertical-cavity surface-emitting lasers for data communication and sensing Download： 956次

Fig. 1. Schematic of a top-emitting VCSEL [19]. Inset is a scanning electron microscope image of the cross section of a high-speed VCSEL after it is cleaved.

Fig. 2. Small-signal model of a VCSEL with the high-frequency driving source.

Fig. 3. Schematic of representative optical modes (straight lines) and gain spectra (curves) behavior in a VCSEL as functions of increasing temperature. T0 denotes the typical room temperature.

Fig. 4. Simulated PAM4 and on–off keying (OOK) eye diagrams at 40 Gbps with a constant modulation bandwidth of 20 GHz.

Fig. 6. Schematic of a tracking system based on SMI [129,130].

Fig. 7. Components of a face recognition module in a modern smartphone. (a) VCSELs for time-of-flight (ToF) proximity sensing and IR illumination. (b) VCSEL array for projection of randomly distributed dots to sense object distance information.

Fig. 8. (a) Schematic of focal plane scanning [148,151]. (b) Illustration of structured light [153].

Table1. Modulation Bandwidths and Bit Rates of VCSELs at Room Temperature Using the Standard On–Off Keying in a Back-to-Back Data Transmission Configuration

Table2. Selected Results on Bandwidths and Bit Rates of VCSELs at High Temperatures in an On–Off Keying Modulation Format for Back-to-Back Data Transmission Configuration

Table3. Energy Efficiencies of High-Speed VCSELs with the On–Off Keying Modulation Format in a Back-to-Back Data Transmission Configuration

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Vertical-cavity surface-emitting lasers for data communication and sensing Download： 956次

Fig. 1. Schematic of a top-emitting VCSEL [19]. Inset is a scanning electron microscope image of the cross section of a high-speed VCSEL after it is cleaved.

Fig. 2. Small-signal model of a VCSEL with the high-frequency driving source.

Fig. 3. Schematic of representative optical modes (straight lines) and gain spectra (curves) behavior in a VCSEL as functions of increasing temperature. T0 denotes the typical room temperature.

Fig. 4. Simulated PAM4 and on–off keying (OOK) eye diagrams at 40 Gbps with a constant modulation bandwidth of 20 GHz.

Fig. 6. Schematic of a tracking system based on SMI [129,130].

Fig. 7. Components of a face recognition module in a modern smartphone. (a) VCSELs for time-of-flight (ToF) proximity sensing and IR illumination. (b) VCSEL array for projection of randomly distributed dots to sense object distance information.

Fig. 8. (a) Schematic of focal plane scanning [148,151]. (b) Illustration of structured light [153].

Table1. Modulation Bandwidths and Bit Rates of VCSELs at Room Temperature Using the Standard On–Off Keying in a Back-to-Back Data Transmission Configuration

Table2. Selected Results on Bandwidths and Bit Rates of VCSELs at High Temperatures in an On–Off Keying Modulation Format for Back-to-Back Data Transmission Configuration

Table3. Energy Efficiencies of High-Speed VCSELs with the On–Off Keying Modulation Format in a Back-to-Back Data Transmission Configuration

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