红外与激光工程, 2005, 34 (5): 505, 网络出版: 2006-05-25  

光电子封装中新型激光焊接吸收薄膜的设计

Design of novel absorptive thin film for laser welding in optoelectronic device capsulation
作者单位
中山大学,光电子技术与材料国家重点实验室,广东,广州,510275
摘要
设计了一种用于对SiO2、Si和LiNbO3等材料进行激光焊接的吸收薄膜.这种"金属-介质-金属"的三层吸收薄膜减少了夹在透明母料之间的焊料表面对Nd:YAG激光束的反射.该设计使激光能量在实验中的实际吸收率超过99%.这种吸收膜与焊料层的结合使激光能更有效地转化为热能,减少了激光穿透母料的能量.这样也就减少了因为激光的透射而导致母料损伤的可能性,使激光能量得到更有效的利用.同时,焊接成品的力学性能也得到了有效提高.
Abstract
A kind of absorptive thin film was designed and used in laser welding of SiO2, Si and LiNbO3. This absorptive thin film of three layer metal-dielectric-metal structure is designed for further reducing the high reflectance of the Nd:YAG laser beam on the surface of the thin layer that is utilized as solder between the transparent parent materials. The actual absorption of laser energy in experiment exceeds 99%. This combination of absorber and solder transformed the laser energy into heat efficiently and decreased the minimum necessary incident laser power transmitting through the transparent parent materials. As a result, the damage of the parent materials, which is suffered from laser transmission, was avoided; On the other hand, mechanical stability of the welded materials had been improved. Experiment shows the difference between welding with and without the absorptive thin film.[

江绍基, 李伟多, 金涛, 汪河洲. 光电子封装中新型激光焊接吸收薄膜的设计[J]. 红外与激光工程, 2005, 34(5): 505. 江绍基, 李伟多, 金涛, 汪河洲. Design of novel absorptive thin film for laser welding in optoelectronic device capsulation[J]. Infrared and Laser Engineering, 2005, 34(5): 505.

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